Differential chip performance within a multi-chip package

• US 7,518,231 B2
• Filed: 08/15/2005
• Issued: 04/14/2009
• Est. Priority Date: 08/15/2005
• Status: Expired due to Fees

• Current Assignee: Polaris Innovations Limited (Wi-LAN Inc.)
• Original Assignee: Infineon Technologies AG
• Inventors: Dietz, James, Negussu, Petros, Le, Thoai Thai
• Primary Examiner(s): Jackson, Jr.; Jerome
• Assistant Examiner(s): Valentine; Jami M
• Application Number:
  US11/203,861
• Publication Number:
  US 20070035007A1
• Time in Patent Office: 1,338 Days
• Field of Search: 257/700, 257/E23.003
• US Class Current: 257/700
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/06506 Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06562 at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

A multi-chip package comprising at least a first die and a second die, wherein each die comprises an integrated circuit (IC) disposed thereon. Each of the first die and the second die comprise a plurality of contact pads coupled with the respective IC. The contact pads on the first IC comprise a first mode pad coupled to a first device formed on the first die, and the contact pads on the second IC comprise a second mode pad coupled to a second device formed on the second die. The first mode pad is coupled to a first potential and causes the first device to operate in a first mode. The second mode pad is coupled to a second potential and causes the second device to operate in a second mode. The first and second mode are selected based on the relative position of the first and second die.

Claims

1. A multi-chip package, comprising:

a plurality of data inputs;

a first supply voltage input configured to receive a first supply voltage level;

a second supple voltage input configured to receive a second supple voltage level different from the first supply voltage level;

a substrate comprising a plurality of first contact pads, at least one first supply voltage pad, and at least one second supply voltage pad, wherein the first contact pads are coupled to the plurality of data inputs, wherein the first supple voltage pad is coupled to the first supply voltage input, and wherein the second supply voltage pad is coupled to the second supple voltage input;

a die of the multi-chip package comprising an integrated circuit, a driver circuit including a default driver and an additional driver, a plurality of second contact pads and at least one first mode pad coupled to the additional driver; and

an interconnect conductively coupling the plurality of first contact pads and the plurality of second contact pads, wherein the first mode pad is coupled to the first supply voltage pad when the interconnect has a first length, and wherein the first mode pad is coupled to the second supply voltage pad when the interconnect has a second length, the second length being greater than the first length, wherein the additional driver is configured to be disabled when the first mode pad is connected to the first supply voltage pad and to be enabled when the first mode pad is connected to the second supply voltage pad, and wherein the driver circuit is configured to output a first output signal with a first power level provided by the default driver, and a second output signal with a second power level provided by the default driver and the additional driver, the second power level being higher than the first power level.

2. The multi-chip package of claim 1, wherein the mode is selected to achieve a relatively more balanced performance of the integrated circuit relative to a further integrated circuit in the multi-chip package.

3. The multi-chip package of claim 1, wherein the first mode pad is coupled to the first supply voltage pad when the length of the interconnect is shorter than a predetermined length, and wherein the first mode pad is coupled to the second supply voltage pad when the length of the interconnect is longer than the predetermined length.

4. A system, comprising the multi-chip package of claim 1 and a plurality of electrical components, the plurality of electrical components being at least one of structurally and functionally related.

5. The system of claim 4, wherein at least one of the plurality of electrical components is a printed-circuit board (PCB).

6. A multi-chip package, comprising:

a substrate comprising a plurality of first contact pads, at least one first supply voltage pad, and at least one second supply voltage pad;

a first die of the multi-chip package comprising a first integrated circuit, a first driver circuit including a default driver and an additional driver, a plurality of second contact pads and at least one first mode pad coupled to the additional driver, wherein the additional first driver is configured to be disabled when the first mode pad is connected to the first supply voltage pad and to be enabled when the first mode pad is connected to the second supply voltage pad;

a first interconnect conductively coupling a number of the plurality of first contact pads and the plurality of second contact pads, the first interconnect having a first length;

a second die of the multi-chip package comprising a second integrated circuit, a second driver circuit including a default driver and an additional driver, a plurality of third contact pads and at least one second mode pad coupled to the additional driver, wherein the additional driver is configured to be disabled when the second mode pad is connected to the first supply voltage pad and to be enabled when the second mode pad is connected to the second supply voltage pad; and

a second interconnect conductively coupling a number of the plurality of first contact pads and the plurality of third contact pads, the second interconnect having a second length longer than the first length, wherein the first mode pad is coupled to the first supply voltage pad and the second mode pad is coupled to the second supply voltage pad, and wherein the first driver circuit outputs a first output signal with a first power level provided by the default driver, and the second driver circuit outputs a second output signal with a second power level provided by the default driver and the additional driver, the second power level being higher than the first power level.

7. multi-chip package of claim 6 wherein the first mode and the second mode are selected to achieve a relatively more balanced performance of the first and second dies.

8. The multi-chip package of claim 6, wherein the first and second interconnect comprises wire bonds.

9. A multi-chip package, comprising:

means for supporting a plurality of first contact pads, at least one first supply voltage pad, and at least one second supply voltage pad;

means for housing a first die of the multi-chip package comprising a first integrated circuit, a first driver circuit including a default driver and an additional driver, a plurality of second contact pads and at least one first mode pad coupled to the additional driver, wherein the additional first driver is configured to be disabled when the first mode pad is connected to the first supply voltage pad and to be enabled when the first mode pad is connected to the second supply voltage pad, the means for housing the first integrated circuit being disposed on the means for supporting;

first means for conductively coupling a number of the plurality of first contact pads and the plurality of second contact pads, the first means for conductively coupling having a first length;

means for housing a second die of the multi-chip package comprising a second integrated circuit, a second driver circuit including a default driver and an additional driver, a plurality of third contact pads and at least one second mode pad coupled to the additional driver wherein the additional driver is configured to be disabled when the second mode pad is connected to the first supply voltage pad and to be enabled when the second mode pad is connected to the second supply voltage pad, the means for housing the second integrated circuit disposed on the means for supporting;

second means for conductively coupling a number of the plurality of first contact pads and the plurality of third contact pads, the second means for conductively coupling having a second length longer than the first length, wherein the first mode pad is coupled to the first supply voltage pad and the second mode pad is coupled to the second voltage pad, and wherein the first driver circuit outputs a first output signal with a first power level provided by the default driver, and the second driver circuit outputs a second output signal with a second power level provide by the default driver and the additional driver, the second power level being higher than the first power level.