Chuck for holding a device under test

• US 7,518,358 B2
• Filed: 10/23/2007
• Issued: 04/14/2009
• Est. Priority Date: 09/05/2000
• Status: Expired due to Fees

• Current Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Dunklee, John
• Primary Examiner(s): Karlsen; Ernest F
• Application Number:
  US11/977,051
• Publication Number:
  US 20080042674A1
• Time in Patent Office: 539 Days
• Field of Search: 285114-116, 285/148.3, 324754-765, 324/158.1
• US Class Current: 324/756.07
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support
• CPC Class Codes: Y10T 279/11 Vacuum
• CPC Class Codes: Y10T 279/35 Miscellaneous

Abstract

A chuck for a probe station.

Claims

1. A chuck for a probe station comprising:

(a) a first chuck assembly element having a lower surface and an upper surface suitable to support a wafer, said first chuck assembly element defining at least one first air path therein to said upper surface;

(b) a second chuck assembly element having an upper surface in opposing relationship to said lower surface of said first chuck assembly element, said second chuck assembly defining at least one second air path therein; and

(c) an interconnecting member interconnecting said first air path and said second air path in such a manner that a fluid having a pressure may be communicated from said first air path to said second air path, said interconnecting member movable with respect to at least one of said first chuck assembly element and said second chuck assembly element at a respective one of a first interface of said interconnecting member and said first chuck assembly and a second interface of said interconnecting member and said second chuck assembly.

2. The chuck of claim 1 further comprising:

(a) said first chuck assembly element defining a first opening in said lower surface of said first chuck assembly element; and

(b) said interconnecting member engaged with said first opening.

3. The chuck of claim 1 further comprising:

(a) said second chuck assembly element defining a second opening in said upper surface of said second chuck assembly element; and

(b) said interconnecting member engaged with said second opening.

4. The chuck of claim 2 further comprising:

(a) said first chuck assembly element defining a first opening in said lower surface of said first chuck assembly element; and

(b) said interconnecting member engaged with said first opening.

5. The chuck of claim 4 wherein said interconnecting member is engaged with said first and second openings in a manner that provides a vacuum seal.

6. The chuck of claim 5 wherein said interconnecting member includes an elongate opening defined therein to interconnect said first air path and said second air path in such a manner that said fluid having a pressure may be communicated from said first air path to said second air path.

7. The chuck of claim 1 further comprising a chuck spacing mechanism connected to said first chuck assembly element having exactly three independent supports defining the spacing between said first chuck assembly element and said second chuck assembly element.

8. The chuck of claim 1 further comprising:

(a) said lower surface of first chuck assembly element defining at least one recess therein; and

(b) a cover plate in overlying relationship to said lower surface of said first chuck assembly element together defining at least a portion of an air path to said upper surface suitable for providing a vacuum to said wafer supported by said upper surface.

9. The chuck of claim 1 further comprising:

(a) a chuck spacing mechanism interconnecting said first and second chuck assembly elements and defining the spacing between said first and second chuck assembly elements; and

(b) a cover plate in overlying relationship to at least a major portion of said lower surface of said second chuck assembly proximate said chuck spacing mechanism element.

10. The chuck of claim 1 further comprising:

(a) a chuck spacing mechanism interconnecting said first and second chuck assembly elements and defining the spacing between said first and second chuck assembly elements; and

(b) said chuck spacing mechanism including a generally U-shaped insulator having a first surface in pressing engagement with said upper surface of said second chuck assembly element and a second surface in pressing engagement with a first surface of a generally U-shaped conductive spacer, a second surface of said U-shaped conductive spacer in pressing engagement with said lower surface of said first chuck assembly element.

11. The chuck of claim 1 further comprising:

(a) a chuck spacing mechanism interconnecting said first and second chuck assembly elements and defining the spacing between said first and second chuck assembly elements; and

(b) said chuck spacing mechanism including an insulator having a first surface in pressing engagement with said upper surface of said second chuck assembly element and a second surface in pressing engagement with a first surface of a conductive spacer, a second surface of said conductive spacer in pressing engagement with said lower surface of said first chuck assembly element, where said first surface of said insulator in pressing engagement with said upper surface is substantially directly opposing and coextensive with said second surface of said insulator in pressing engagement with said conductive spacer.

12. The chuck of claim 1 further comprising:

(a) a chuck spacing mechanism interconnecting said first and second chuck assembly elements and defining the spacing between said first and second chuck assembly elements; and

(b) said chuck spacing mechanism including an insulator having a first surface in pressing engagement with said upper surface of said second chuck assembly element and a second surface in pressing engagement with a first surface of a conductive spacer, a second surface of said conductive spacer in pressing engagement with said lower surface of said first chuck assembly element, where said first surface of said insulator in pressing engagement with said upper surface is less than one third the thickness of said conductive spacer in pressing engagement with said second surface.