Probe card and a method for detecting defects using a probe card and an additional inspection

• US 7,518,391 B2
• Filed: 02/15/2005
• Issued: 04/14/2009
• Est. Priority Date: 02/17/2004
• Status: Expired due to Fees

• Current Assignee: Applied Materials Israel Limited (Applied Materials Incorporated)
• Original Assignee: Applied Materials Israel Limited (Applied Materials Incorporated)
• Inventors: Langer, Moshe, Tirosh, Ehud
• Primary Examiner(s): Patel; Paresh
• Application Number:
  US11/059,141
• Publication Number:
  US 20050278134A1
• Time in Patent Office: 1,519 Days
• Field of Search: None
• US Class Current: 324/754.08
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392

Abstract

A method and system for defect localization including (i) receiving a test structure that includes at least one conductor that is at least partially covered by an electro-optically active material; (ii) providing an electrical signal to the conductor, so as to charge at least a portion of the conductor; and (iii) imaging the test structure to locate a defect.

Claims

1. A method for detecting defects in a test structure array using a probe card, said method comprising:

(a) supplying, by the probe card, at least one electrical signal to a first set of test pads, said first set of test pads being electrically coupled to a first set of test structures, while imaging said first set of test structures; and

(b) supplying, by the probe card, at least one electrical signal to a second set of test pads, said second set of test pads being electrically coupled to a second set of test structures, while imaging said second set of test structures,

wherein while supplying the electrical signal to the first set of test pads, the probe card block at least a portion of the second set of test structures from being imaged, while not blocking the first set of test structures from being imaged.

2. The method of claim 1 wherein after imaging of the first set of test structures, the probe card is moved relative to the test structure array, said test structure array comprising the first and second set of test structures and the first and second set of test pads.

3. The method of claim 2 wherein said relative movement is a rotational movement.

4. The method of claim 2 wherein said relative movement is a linear movement.

5. The method of claim 1 wherein the first set of test pads comprises about half of a total number of test pads of the test structure array, said test structure array comprising the first and second set of test structures and the first and second set of test pads.

6. The method of claim 1 wherein the probe card comprises a pin area positioned near a perimeter of the probe card.

7. The method of claim 1 further comprising determining, by a tester, to which test structure array out of multiple test structure arrays to apply the electrical signals.