Tunable high impedance surface device
First Claim
1. A tunable high impedance apparatus comprising:
- a conductive ground plane;
a plurality of conductive elements electrically connected to the conductive ground plane;
a plurality of capacitive elements disposed at a predetermined position relative to the conductive elements to allow for a predetermined electromagnetic characteristic to be controllably varied;
standoffs between the plurality of capacitive elements and the plurality of conductive elements; and
electrically conductive micro-vias extending through the standoffs electrically connecting the plurality of capacitive elements to a data bus.
2 Assignments
0 Petitions
Accused Products
Abstract
A tunable high impedance surface device (100) includes a conductive ground plane (105) and a plurality of conductive elements (110-114) electrically connected to the conductive ground plane (105). The device (100) also includes a plurality of capacitive elements (120-124) operable to vary a predetermined electromagnetic characteristic of the apparatus and standoffs (130, 132) between the plurality of capacitive elements (120-124) and the plurality of conductive elements (110-114). In one form, laser-drilled and electrically conductive micro-vias (136, 138) extend through the standoffs (130, 132) thereby electrically connecting the plurality of capacitive elements (120-124) to a data bus (140). The capacitive elements (120-124) may be integral with a circuit board (144) that supports the plurality conductive elements (110-114). Either the capacitive elements (120-124) or the conductive elements (110-114) are mechanically flexible and selectively movable to controllably adjust the distance (142) between the capacitive and conductive elements.
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Citations
15 Claims
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1. A tunable high impedance apparatus comprising:
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a conductive ground plane; a plurality of conductive elements electrically connected to the conductive ground plane; a plurality of capacitive elements disposed at a predetermined position relative to the conductive elements to allow for a predetermined electromagnetic characteristic to be controllably varied; standoffs between the plurality of capacitive elements and the plurality of conductive elements; and electrically conductive micro-vias extending through the standoffs electrically connecting the plurality of capacitive elements to a data bus. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An apparatus comprising:
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a conductive ground plane disposed on a first side of a circuit board; a plurality of conductive elements disposed on a second side of the circuit board and electrically connected to the conductive ground plane; a second plurality of conductive elements that are spaced relative to the second side of the circuit board and adjacent to at least two of the plurality of conductive elements thereon; integral standoffs disposed on the second side of the circuit board and affixed to the second plurality of conductive elements for supporting and integrating the second plurality of conductive elements to the circuit board; laser-drilled and electrically conductive micro-vias electrically connecting the second plurality of conductive elements through the integral standoffs to a second plurality of conductive vias in the circuit board connected to a data bus. - View Dependent Claims (15)
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Specification