IC card and booking account system using the IC card

• US 7,518,692 B2
• Filed: 12/19/2003
• Issued: 04/14/2009
• Est. Priority Date: 12/27/2002
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Goto, Yuugo, Ohno, Yumiko, Takayama, Toru, Maruyama, Junya, Akiba, Mai, Yamazaki, Shunpei
• Primary Examiner(s): Dudek; James A
• Application Number:
  US10/739,084
• Publication Number:
  US 20040129450A1
• Time in Patent Office: 1,943 Days
• Field of Search: 349/151, 349/153
• US Class Current: 349/153
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07703 the interface being visual
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06Q 20/341 Active cards, i.e. cards including their own processing means, e.g. including an IC or chip
• CPC Class Codes: G06Q 20/40145 Biometric identity checks
• CPC Class Codes: G07F 7/1008 Active credit-cards provided with means to personalise their use, e.g. with PIN-introduction/comparison system

Abstract

It is an object of the present invention to provide a highly sophisticated functional card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. A card comprising a display device and a thin film integrated circuit; wherein driving of the display device is controlled by the thin film integrated circuit; a semiconductor element used for the thin film integrated circuit and the display device is formed by using a polycrystalline semiconductor film; the thin film integrated circuit and the display device are sealed with a resin between a first substrate and a second substrate of the card; and the first substrate and the second substrate are plastic substrates.

Claims

1. A card comprising:

a display device comprising a first semiconductor element comprising a first polycrystalline semiconductor film;

a first thin film integrated circuit comprising a second semiconductor element comprising a second polycrystalline semiconductor film;

a first substrate; and

a second substrate,

wherein the display device is electrically connected to the first thin film integrated circuit,

wherein the first thin film integrated circuit and the display device are covered and sealed with a resin between the first substrate and the second substrate of the card,

wherein the resin is in contact with the second substrate; and

wherein the first substrate and the second substrate comprise a plastic material.

2. A card according to claim 1, wherein the card has a thickness from 0.05 mm through 1.5 mm.

3. A card according to claim 1, wherein the display device is a passive matrix type display device.

4. A card according to claim 1, wherein the display device is an active matrix type display device.

5. A card according to claim 1, further comprising:

a second thin film integrated circuit,

wherein the first and second thin film integrated circuits are laminated.

6. A card according to claim 1, wherein the display device is a liquid crystal display device.

7. A card according to claim 1, wherein the display device is a light emitting device.

8. A card according to claim 1, wherein the card is an ID card.

9. A card according to claim 1, wherein the card is a semi-hard card.

10. A card according to claim 1, wherein the card is an IC card.

12. A card according to claim 5, further comprising an insulating film,

wherein the display device and one of the first and second thin film integrated circuits are in contact with the insulating film.

13. A card according to claim 1, further comprising:

an antenna; and

an insulating film,

wherein the display device, the first thin film integrated circuit and the antenna are in contact with the insulating film.

14. A card according to claim 1, wherein the display device comprises a third substrate.

19. A card according to claim 1 further comprising:

an adhesive below the first thin film integrated circuit and the display device, and in contact with the first substrate.

20. A card according to claim 19, wherein the adhesive is a photo-curing adhesive or a light curing adhesive.

21. A card according to claim 19, wherein the adhesive includes a powder comprising one of silver, nickel, aluminum, and aluminum nitride or a filler.

11. A card comprising:

a first substrate comprising a plastic material;

a display device comprising a first semiconductor element comprising a first polycrystalline semiconductor film over the first substrate;

a first thin film integrated circuit comprising a second semiconductor element comprising a second polycrystalline semiconductor film over the first substrate;

a resin over the display device and the first thin film integrated circuit; and

a second substrate comprising a plastic material over the resin,

wherein the resin is in contact with the second substrate.

15. A card according to claim 11, further comprising a second thin film integrated circuit comprising a third semiconductor element comprising a third polycrystalline semiconductor film;

wherein the first and second thin film integrated circuits are laminated to each other.

16. A card according to claim 15, further comprising an insulating film,

wherein the display device and one of the first and second thin film integrated circuits are in contact with the insulating film.

17. A card according to claim 11, further comprising:

an antenna; and

an insulating film,

wherein the display device, the first thin film integrated circuit and the antenna are in contact with the insulating film.

18. A card according to claim 11, wherein the display device comprises a third substrate.

22. A card according to claim 11 further comprising:

an adhesive below the first thin film integrated circuit and the display device, and in contact with the first substrate.

23. A card according to claim 22, wherein the adhesive is a photo-curing adhesive or a light curing adhesive.

24. A card according to claim 22, wherein the adhesive includes a powder comprising one of silver, nickel, aluminum, and aluminum nitride or a filler.

25. A booking-account system using a card comprising:

a display device comprising a first semiconductor element comprising a first polycrystalline semiconductor film; and

a first thin film integrated circuit comprising a second semiconductor element comprising a second polycrystalline semiconductor film;

wherein the first thin film integrated circuit and the display device are covered and sealed with a resin between a first substrate and a second substrate, the resin being in contact with the second substrate,

wherein the display device is electrically connected to the first thin film integrated circuit and driving of the display device is controlled by the first thin film integrated circuit, and

wherein information is memorized in the first thin film integrated circuit and displayed by the display device.

26. A booking-account system using a card according to claim 25, wherein the information is an account balance, amount of money of a transaction, a date, or an image of an owner of the card.

27. A booking-account system using a card according to claim 25, wherein the first substrate and the second substrate comprise a plastic material.

28. A booking-account system using a card according to claim 25, further comprising:

a second thin film integrated circuit,

wherein the first and second thin film integrated circuits are laminated.

29. A booking-account system using a card according to claim 25, further comprising an insulating film, wherein the display device and the first thin film integrated circuit are in contact with the insulating film.

30. A booking-account system using a card according to claim 25, further comprising:

an antenna; and

an insulating film,

wherein the display device, the first thin film integrated circuit and the antenna are in contact with the insulating film.

31. A booking-account system using a card according to claim 25, wherein the display device comprises a third substrate.

32. A booking-account system using a card according to claim 25, further comprising a second thin film integrated circuit comprising a third semiconductor element comprising a third polycrystalline semiconductor film;

wherein the first and second thin film integrated circuits are laminated to each other.

33. A booking-account system using a card according to claim 25, further comprising an insulating film, wherein the display device and one of the first and second thin film integrated circuits are in contact with the insulating film.

34. A booking-account system using a card according to claim 25, further comprising an adhesive below the first thin film integrated circuit and the display device, and in contact with the first substrate.

35. A booking-account system using a card according to claim 34, wherein the adhesive is a photo-curing adhesive or a light curing adhesive.

36. A booking-account system using a card according to claim 34, wherein the adhesive includes a powder comprising one of silver, nickel, aluminum, and aluminum nitride or a filler.

37. A booking-account system using a card according to claim 25, wherein the card has a thickness from 0.05 mm through 1.5 mm.

38. A booking-account system using a card according to claim 25, wherein the display device is a passive matrix type display device.

39. A booking-account system using a card according to claim 25, wherein the display device is an active matrix type display device,

40. A booking-account system using a card according to claim 25, wherein the display device is a liquid crystal display device.

41. A booking-account system using a card according to claim 25, wherein the display device is a light emitting device.

42. A booking-account system using a card according to claim 25, wherein the card is an IC card including an ATM card, train pass, or a prepaid card.

43. A booking-account system using a card according to claim 25, wherein the card is an ID card.

44. A booking-account system using a card according to claim 25, wherein the card is a semi-hard card.

45. A booking-account system using a card comprising:

a first substrate comprising a plastic material;

a display device comprising a first semiconductor element comprising a first polycrystalline semiconductor film over the first substrate;

a first thin film integrated circuit comprising a second semiconductor element comprising a second polycrystalline semiconductor film over the first substrate;

a resin over the display device and the first thin film integrated circuit; and

a second substrate comprising a plastic material over the resin, the resin being in contact with the second substrate,

wherein information is memorized in the first thin film integrated circuit and displayed by the display device.

46. A booking-account system using a card according to claim 45, wherein the information is an account balance, amount of money of a transaction, a date, or an image of an owner of the card.

47. A booking-account system using a card according to claim 45, further comprising:

a second thin film integrated circuit,

wherein the first and second thin film integrated circuits are laminated,

48. A booking-account system using a card according to claim 45, further comprising an insulating film, wherein the display device and the first thin film integrated circuit are in contact with the insulating film.

49. A booking-account system using a card according to claim 45, further comprising:

an antenna; and

an insulating film,

wherein the display device, the first thin film integrated circuit and the antenna are in contact with the insulating film.

50. A booking-account system using a card according to claim 45, wherein the display device comprises a third substrate.

51. A booking-account system using a card according to claim 45, further comprising a second thin film integrated circuit comprising a third semiconductor element comprising a third polycrystalline semiconductor film;

wherein the first and second thin film integrated circuits are laminated to each other.

52. A booking-account system using a card according to claim 51, further comprising an insulating film, wherein the display device and one of the first and second thin film integrated circuits are in contact with the insulating film.

53. A booking-account system using a card according to claim 45, further comprising an adhesive below the first thin film integrated circuit and the display device, and in contact with the first substrate,

54. A booking-account system using a card according to claim 53, wherein the adhesive is a photo-curing adhesive or a light curing adhesive.

55. A booking-account system using a card according to claim 53, wherein the adhesive includes a powder comprising one of silver, nickel, aluminum, and aluminum nitride or a filler.

56. A booking-account system using a card according to claim 45, wherein the card has a thickness from 0.05 mm through 1.5 mm.

57. A booking-account system using a card according to claim 45, wherein the display device is a passive matrix type display device.

58. A booking-account system using a card according to claim 45, wherein the display device is an active matrix type display device.

59. A booking-account system using a card according to claim 45, wherein the display device is a liquid crystal display device.

60. A booking-account system using a card according to claim 45, wherein the display device is a light emitting deuce.

61. A booking-account system using a card according to claim 45, wherein the card is an IC card including an ATM card, train pass, or a prepaid card.

62. A booking-account system using a card according to claim 45, wherein the card is an ID card.

63. A booking-account system using a card according to claim 45, wherein the card is a semi-hard card.

64. A booking-account system using a card according to claim 45, wherein the display device is electrically connected to the first thin film integrated circuit and driving of the display device is controlled by the first thin film integrated circuit.