Shielding arrangement for electronic device

• US 7,518,880 B1
• Filed: 02/06/2007
• Issued: 04/14/2009
• Est. Priority Date: 02/08/2006
• Status: Expired due to Fees

• Current Assignee: Bi-Link
• Original Assignee: Bi-Link
• Inventors: Ziberna, Frank J.
• Primary Examiner(s): Reichard; Dean A.
• Assistant Examiner(s): Chen; Xiaoliang
• Application Number:
  US11/702,729
• Time in Patent Office: 798 Days
• Field of Search: 361/737, 361/753, 361/799, 361/800, 361/816, 361/818, 174/350, 174/351, 438/106, 438/121
• US Class Current: 361/737
• CPC Class Codes: H05K 9/0084 comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Abstract

A shielding arrangement for an electronic component mounted on a circuit board includes a shield formed by a frame sidewall arranged to be oriented upstanding from the circuit board and surrounding the electronic component mounted on the circuit board. A first cover portion substantially closes the surrounding sidewall, enclosing the electronic component on the circuit board. A conductive layer, formed by vacuum deposition covers an inside surface of the surrounding sidewall and an inside surface of the first cover portion, continuously. As an alternative to the conductive layer, the frame can be composed of an electrically conductive plastic. The first cover portion can be a stamped metal plate integrated with the frame by overmolding.

Claims

1. An electronic device, comprising:

a circuit board and an electronic component mounted to a first side of said circuit board;

a first frame composed of a molded material and secured around its perimeter to said first side of said circuit board, and comprising a plurality of longitudinally arranged rails and laterally arranged rails defining at least one closed perimeter that surrounds said electronic component on said circuit board;

a metal first cover portion carried by said first frame and closing said at least one closed perimeter, forming a chamber;

a layer of conductive material adhered to and covering an inside surface of said closed perimeter and said metal first cover portion;

a second frame, secured around its perimeter to an opposite side of said circuit board, and comprising a plurality of longitudinally extended rails and laterally extending rails at least partially defining a perimeter of said second frame; and

a metal second cover portion carried by said second frame and closing said second frame.

2. The device according to claim 1, wherein said layer of conductive material extends continuously from said inside surface of said closed perimeter onto an inside surface of said metal first cover portion, covering said metal first cover portion.

3. The device according to claim 2, wherein said first frame is adhesively secured to said first side of said circuit board with electrically conductive adhesive.

4. The device according to claim 3, wherein said first frame comprises a plurality of closed perimeters each of which surrounds an electronic component mounted on said circuit board, and wherein said metal first cover portion closes said plurality of closed perimeters, and wherein each of said closed perimeters are sealed to said circuit hoard by conductive adhesive.

5. The device according to claim 4, wherein said first frame is adhesively secured to said first side of said circuit board with electrically conductive adhesive, and wherein said first frame and said second frame each comprise a stepped shoulder surface for fitting against an outer edge region of a respective side of said circuit board, and an outer surface located outside of a perimeter of said circuit board, said respective outer surfaces being in abutting relationship when said circuit board is fit between said upper frame and said bottom frame with said respective outer edge regions abutting said respective stepped shoulder surfaces, wherein said facing surfaces are secured by a fast adhering means for holding said upper frame, said circuit board, said bottom frame, said first cover portion and said second cover portion together as a unit while allowing said conductive adhesive to cure for a longer period of time.

6. The device according to claim 1, wherein said first frame is configured identically to said second frame, and said first cover portion is configured identically with said second cover portion.

7. The device according to claim 1, comprising:

at least one second electronic component mounted on said second side of said circuit board, wherein said second frame is composed of a molded material, and comprising longitudinally arranged rails and laterally arranged rails that define at least one second closed perimeter that surrounds said at least one second electronic component on said circuit board;

said second cover portion closing said at least one closed perimeter, forming a second chamber; and

a second layer of conductive material adhered to and covering an inside surface of said second chamber.

8. The device according to claim 7, wherein said second layer of conductive material extends continuously from said inside surface of said second closed perimeter onto an inside surface of said second cover portion, covering said second cover portion.

9. The device according to claim 4, wherein said metal first cover portion comprises a stamped metal plate, said stamped metal plate having formations for integrating said stamped metal plate with said first frame when said first frame is over molded onto said metal plate.

10. The device according to claim 9, wherein said formations comprise a plurality of spaced-apart holes through said stamped metal plate.

11. The device according to claim 10, wherein said stamped metal plate comprises elongated trough regions corresponding in extent to portions of said longitudinally extending rails and said laterally extending rails, and at least one of said trough regions having said spaced-apart holes therethrough, and when said first frame is over molded onto said stamped metal plate, said first frame is formed through said spaced-apart holes and fills said trough region.