Intelligent binning for electrically repairable semiconductor chips
First Claim
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1. A system for detecting failures in a semiconductor device comprising:
- equipment to perform tests of a first type on the semiconductor device to identify failures in the semiconductor device;
processing circuitry to communicate with the test equipment and determine a number of failures and provide signals indicative thereof; and
decision circuitry to receive the signals indicative of the number of failures, and considering the number of failures, either to designate the semiconductor device for an additional procedure, or designate the semiconductor device for repair, or designate the semiconductor device for additional tests of the first type.
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Abstract
The present invention relates to a system and method for testing one or more semiconductor devices (e.g., packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures are determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable.
20 Citations
20 Claims
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1. A system for detecting failures in a semiconductor device comprising:
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equipment to perform tests of a first type on the semiconductor device to identify failures in the semiconductor device; processing circuitry to communicate with the test equipment and determine a number of failures and provide signals indicative thereof; and decision circuitry to receive the signals indicative of the number of failures, and considering the number of failures, either to designate the semiconductor device for an additional procedure, or designate the semiconductor device for repair, or designate the semiconductor device for additional tests of the first type. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method for determining failures in a semiconductor device, the method comprising:
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determining a number of identified failures of a first type on the semiconductor device to identify failures in the semiconductor device; designating the semiconductor device for an additional procedure when the number of the identified failures is within a first number set; repairing the semiconductor device when the number of the identified failures is within a second number set; and performing additional tests of the first type on the semiconductor device when the number of the identified failures is within a third number set. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. A method for determining reliability of a semiconductor device, the method comprising:
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performing tests of a first type on the semiconductor device, identifying failures in the semiconductor device affecting the reliability of the semiconductor device, the failures classified by class and a total number of identified failures for each class is determined, and where the total number of identified failures equals a sum of the identified failures for each class; and determining when the semiconductor device is to have either an additional procedure, repair, or additional tests performed based upon the predetermined combination of the total number of identified failures and the number of identified failures in at least one of the classes.
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Specification