Strain energy shuttle apparatus and method for vibration energy harvesting

• US 7,521,841 B2
• Filed: 02/01/2006
• Issued: 04/21/2009
• Est. Priority Date: 07/30/2003
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Clingman, Dan J., Ruggeri, Robert T.
• Primary Examiner(s): Schuberg; Darren
• Assistant Examiner(s): ROSENAU, DEREK JOHN
• Application Number:
  US11/344,823
• Publication Number:
  US 20060175937A1
• Time in Patent Office: 1,175 Days
• Field of Search: 310/329, 310/339, 310330-332, 310/355
• US Class Current: 310/339
• CPC Class Codes: H02N 2/186 Vibration harvesters
• CPC Class Codes: H10N 30/306 Cantilevers

Abstract

An apparatus for use in low frequency vibration energy harvesting (VEH) and with actuators requiring a low deflection force. The apparatus includes a piezo flexure that is loaded with a compressive pre-load force to place the piezo flexure under compression. The piezo flexure may be supported at an intermediate point or at one end thereof. The compressive pre-load force produces flexes the piezo flexure into one or the other of two stable positions, these positions being offset on opposite sides of a longitudinal centerline representing the position of the piezo flexure that would be produced without the compressive pre-load force applied thereto. The compressive pre-load effectively provides a negative spring constant which “softens” the piezo flexure and enhances a responsiveness of the piezo flexure to low frequency vibration energy. The piezo flexure also operates over a much wider frequency bandwidth than conventional systems incorporating a tip mass.

Claims

1. An energy harvesting apparatus comprising:

a support substrate;

a piezoelectric wafer secured to a surface of said support substrate;

a base for supporting said support substrate in a manner to enable oscillating motion of said support substrate and said piezoelectric wafer;

said base including a frame for supporting said support substrate from an approximate midpoint thereof; and

a pair of biasing elements operatively associated with opposite longitudinal ends of said support substrate, and disposed on opposite lateral sides of said support substrate, and generally longitudinally aligned with a plane of said midpoint of said support substrate, for supplying a mechanical compressive pre-load force to said piezoelectric wafer and said support substrate that is sufficient to deflect outer ends of said support substrate into one of two flexed orientations that are laterally offset from said plane of said midpoint of said support structure, in the absence of vibration energy, to thus soften said piezoelectric wafer to facilitate oscillating motion of said wafer in response to vibration experienced by said base.

2. The apparatus of claim 1, wherein said frame including a boss portion for supporting said support substrate from said approximate midpoint thereof.

3. The apparatus of claim 1, further comprising a pair of link arms coupled to opposite longitudinal ends of said support substrate;

and

wherein said biasing elements are each coupled between said link arms.

4. The apparatus of claim 1, further comprising a pair of said piezoelectric wafers secured to opposing surfaces of said support substrate.

5. The apparatus of claim 3, wherein said pair of said biasing elements are disposed parallel to said support substrate and each coupled at opposite ends thereof to portions of said link arms.

6. The apparatus of claim 1, wherein each said biasing element comprises a coil spring.

7. The apparatus of claim 1, wherein said piezoelectric wafer comprises a piezoelectric ceramic wafer.

8. A method for vibration energy harvesting, comprising:

disposing a piezoelectric wafer on a support substrate;

supporting said support substrate from a midpoint thereof to enable oscillating motion of a pair of outer ends of said support substrate;

arranging a pair of biasing elements generally parallel to said support substrate on opposite lateral sides of said support substrate, and securing opposite ends of each of said biasing elements to said outer ends of said support structure, such that said biasing elements apply a compressive stress to said support substrate that is sufficient to deflect said outer ends of said support substrate, and thus said piezoelectric wafer, from a central, non-flexed position, into one of two flexed positions laterally spaced apart from midpoint, said compressive stress operating to soften said piezoelectric wafer to enhance a response of said wafer to vibration energy.

9. The method of claim 8, further comprising securing said support surface in a manner to enable oscillating motion of opposite longitudinal ends of said piezoelectric wafer.

10. A method for forming an actuator using a piezoelectric wafer, comprising:

supporting the piezoelectric wafer on a support substrate to enable motion of said piezoelectric wafer;

supporting said support substrate from a midpoint thereof such that outer longitudinal ends thereof are free to move; and

using a pair of biasing elements disposed on opposite lateral sides of said support substrate and longitudinally aligned with a midpoint of said support substrate, and operatively coupled to said outer ends of said support substrate, to place said support substrate and said piezoelectric wafer under a compressive pre-load stress sufficient to hold said piezoelectric wafer in one of two stable flexed, non-linear configurations, said compressive pre-load operating to soften said wafer and enhance motion of said outer ends of said support substrate to enhance a sensitivity of said piezoelectric wafer.