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Method of making light emitting diodes (LEDs) with improved light extraction by roughening

  • US 7,524,686 B2
  • Filed: 03/23/2007
  • Issued: 04/28/2009
  • Est. Priority Date: 01/11/2005
  • Status: Active Grant
First Claim
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1. A method comprising:

  • providing a light-emitting diode (LED) wafer assembly having a plurality of LED stacks disposed above a conductive substrate, each of the LED stacks comprising;

    a p-doped layer disposed above the conductive substrate;

    an active layer for emitting light disposed above the p-doped layer; and

    an n-doped layer disposed above the active layer;

    applying a protective layer covering a selected portion of a surface of the n-doped layer for each of the plurality of LED stacks;

    altering the surface of the n-doped layer by at least one of roughening and texturing, wherein the protective layer shields the selected portion of each of the plurality of LED stacks during the altering;

    removing the protective layer; and

    forming an n-electrode above the selected portion after removing the protective layer.

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