×

Process of forming an electronic device including an inductor

  • US 7,524,731 B2
  • Filed: 09/29/2006
  • Issued: 04/28/2009
  • Est. Priority Date: 09/29/2006
  • Status: Expired due to Fees
First Claim
Patent Images

1. A process of forming an electronic device comprising:

  • forming an interconnect level overlying a die substrate, wherein the interconnect level comprises a first interconnect and a second interconnect;

    forming a shock-absorbing layer overlying the interconnect level;

    patterning the shock-absorbing layer to define a first opening that exposes the first interconnect and a second opening that exposes the second interconnect;

    forming conductive traces, wherein;

    the conductive traces include a first conductive trace and a second conductive trace;

    a via portion of the first conductive trace extends to the first opening of the shock-absorbing layer and is electrically connected to the first interconnect, and a primary pad portion of the first conductive trace overlies the shock-absorbing layer; and

    a secondary pad portion of the second conductive trace overlies the shock-absorbing layer, and a via portion of the second conductive trace extends to the second opening of the shock-absorbing layer and is electrically connected to the second interconnect; and

    attaching at least one wire to the conductive traces to form an inductor, wherein;

    a first wire of the at least one wire is attached to the primary pad portion of the first conductive trace; and

    the first wire or a second wire of the at least one wire is attached to the secondary pad portion of the second conductive trace.

View all claims
  • 30 Assignments
Timeline View
Assignment View
    ×
    ×