Method for manufacturing a micro-electro-mechanical structure
First Claim
1. A method for manufacturing a micro-electro-mechanical (MEM) structure, comprising the steps of:
- providing a substrate;
etching a plurality of trenches into the substrate with a first etch;
forming a charging layer at a bottom of each of the trenches, wherein the charging layer substantially covers the bottom of the trenches; and
providing a second etch into the trenches to form undercut trenches, wherein the charging layer causes the second etch to laterally etch footers in the substrate between the undercut trenches, and wherein the footers undercut the substrate to release a portion of the substrate for providing a movable structure between the undercut trenches and above the footers.
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Accused Products
Abstract
A technique for manufacturing a micro-electro-mechanical (MEM) structure includes a number of steps. Initially, a substrate is provided. Next, a plurality of trenches are etched into the substrate with a first etch. Then, a charging layer is formed at a bottom of each of the trenches to form undercut trenches. Finally, a second etch is provided into the undercut trenches. The charging layer causes the second etch to laterally etch foots in the substrate between the undercut trenches. The footers undercut the substrate to release a portion of the substrate for providing a movable structure between the undercut trenches and above the footers.
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Citations
24 Claims
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1. A method for manufacturing a micro-electro-mechanical (MEM) structure, comprising the steps of:
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providing a substrate; etching a plurality of trenches into the substrate with a first etch; forming a charging layer at a bottom of each of the trenches, wherein the charging layer substantially covers the bottom of the trenches; and providing a second etch into the trenches to form undercut trenches, wherein the charging layer causes the second etch to laterally etch footers in the substrate between the undercut trenches, and wherein the footers undercut the substrate to release a portion of the substrate for providing a movable structure between the undercut trenches and above the footers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for manufacturing a micro-electro-mechanical (MEM) structure, comprising the steps of:
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providing a substrate; forming a dielectric isolation trench; etching a plurality of undercut trenches into the substrate with a first etch, wherein the undercut trenches comprise a first height trench and a second height trench; forming a charging layer at a bottom of each of a plurality of trenches, wherein the charging layer substantially covers the bottom of the trenches; providing a second etch into the trenches, wherein the charging layer causes the second etch to laterally etch footers in the substrate between the trenches to form the undercut trenches; and providing a movable structure between the undercut trenches. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method for manufacturing a micro-electro-mechanical (MEM) structure, comprising the steps of:
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providing a substrate; etching a plurality of trenches into the substrate with a first etch; forming a charging layer at a bottom of each of the trenches, wherein the charging layer substantially covers the bottom of the trenches; providing a second etch into the trenches to form undercut trenches, wherein the charging layer causes the second etch to laterally etch footers in the substrate between the undercut trenches, and wherein the footers undercut the substrate to release a portion of the substrate for providing a movable structure between the undercut trenches and above the footers; etching at least one isolation trench in the substrate; and filling the at least one isolation trench with a dielectric, wherein the at least one isolation trench electrically isolates the movable structure. - View Dependent Claims (20, 21, 22, 23, 24)
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Specification