Method of making prestructure for MEMS systems

• US 7,527,995 B2
• Filed: 05/20/2005
• Issued: 05/05/2009
• Est. Priority Date: 09/27/2004
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Sampsell, Jeffrey B.
• Primary Examiner(s): Lindsay, Jr.; Walter L
• Assistant Examiner(s): MUSTAPHA, ABDULFATTAH B
• Application Number:
  US11/134,490
• Publication Number:
  US 20060079048A1
• Time in Patent Office: 1,446 Days
• Field of Search: 438/48, 438/142, 438/200, 257/E21.009
• US Class Current: 438/48
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81B 2203/0361 Tips, pillars
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

A method of making an interferometric modulator element includes forming at least two posts, such as posts formed from spin-on glass, on a substrate. In alternate embodiments, the posts may be formed after certain layers of the modulator element have been deposited on the substrate. An interferometric modulator element includes at least two spin-on glass support posts located on the substrate. In alternate embodiments, the support posts may be located over certain layers of the modulator element, rather than on the substrate. A method of making an interferometric modulator element includes forming a rigid cap over a support post. An interferometric modulator element includes support posts having rigid cap members.

Claims

1. A method of forming an interferometric display element, comprising:

providing a substrate;

depositing a layer of support post material over the substrate;

patterning the layer of support post material to form at least two support posts;

depositing an electrode layer over the substrate, wherein the depositing of the electrode layer is performed after the forming of the at least two support posts, and wherein at least a first portion of the electrode layer is located between the at least two support posts;

forming at least a first sacrificial layer over at least the first portion of the electrode layer;

forming a mechanical layer over the sacrificial layer, wherein the mechanical layer covers a portion of each of the at least two support posts; and

removing at least a portion of the first sacrificial layer after formation of the mechanical layer, wherein removal of at least a portion of the first sacrificial layer allows a portion of the mechanical layer extending between the at least two support posts to be displaced with respect to the first portion of the electrode layer.

2. The method of claim 1, wherein the support post material comprises spin-on glass.

3. The method of claim 1, wherein the support post material comprises an insulator.

4. The method of claim 3, wherein the insulator comprises silicon oxide.

5. The method of claim 1, wherein the support post material comprises a metal.

6. The method of claim 1, wherein the mechanical layer comprises a reflective surface on a side of the mechanical layer facing the first portion of the electrode layer.

7. The method of claim 1, additionally comprising:

forming a mirror layer over the electrode layer; and

patterning the mirror layer to form a mirror.

8. The method of claim 7, additionally comprising:

depositing a second layer of sacrificial material over the mirror; and

patterning the second layer of sacrificial material, thereby forming at least one hole in said second layer of sacrificial material, said hole being located over the mirror element.

9. The method of claim 1, wherein forming a mechanical layer over the sacrificial layer comprises:

forming a planarization layer over the sacrificial layer;

etching back the planarization layer to provide a substantially planar surface; and

forming a mechanical layer over the planarization layer.

10. The method of claim 1, additionally comprising:

patterning the mechanical layer, thereby exposing at least a portion of an underlying layer, wherein pattering the mechanical layer is performed prior to removing at least a portion of the first sacrificial layer.

11. The method of claim 1, wherein the mechanical layer is electrostatically displaceable towards the first portion of the electrode layer upon removal of at least a portion of the first sacrificial layer.

12. The method of claim 1, wherein a second portion of the electrode layer overlies a portion of one of the at least two support posts after deposition of the electrode layer, the method additionally comprising removing the second portion of the electrode layer prior to formation of the mechanical layer.

13. The method of claim 12, additionally comprising depositing a layer of liftoff material over the layer of support post material prior to patterning the layer of support post material, wherein the second portion of the electrode layer is located over the liftoff material, and wherein removing the second portion of the electrode layer comprises removing the layer of liftoff material using a liftoff process.

14. A method of forming a micromechanical system (MEMS) element, comprising:

forming at least two support posts located over a substrate;

depositing an electrode layer over the substrate after the formation of the support posts, wherein at least a portion of the electrode layer is located over a support post of the at least two support posts;

forming at least a first sacrificial layer over the electrode layer;

removing the portion of the electrode layer;

forming a movable layer extending over the at least two support posts and the first sacrificial layer, wherein forming the movable layer is performed after removing the portion of the electrode layer; and

removing the first sacrificial layer after forming the movable layer.

15. The method of claim 14, wherein forming at least two support posts comprises:

depositing a layer of support post material over the substrate;

depositing a layer of liftoff material over the layer of support post material; and

patterning the layer of liftoff material and layer of support post material.

16. The method of claim 15, wherein removing the portion of the electrode layer comprises removing liftoff material from over the at least two support posts.

17. The method of claim 14, wherein the at least two support posts comprise an insulating material.

18. The method of claim 14, wherein the at least two support posts comprise spin-on glass.