Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality

• US 7,528,404 B2
• Filed: 02/17/2004
• Issued: 05/05/2009
• Est. Priority Date: 02/17/2004
• Status: Expired due to Fees

• Current Assignee: Henkel AG & Co KGaA
• Original Assignee: Henkel AG & Co KGaA
• Inventors: Musa, Osama M., Zhang, Ruzhi
• Primary Examiner(s): Jackson; Jerome
• Assistant Examiner(s): Ho; Anthony
• Application Number:
  US10/555,291
• Publication Number:
  US 20060263928A1
• Time in Patent Office: 1,904 Days
• Field of Search: 257/40
• US Class Current: 257/40
• CPC Class Codes: C07D 263/10 with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
• CPC Class Codes: C07D 263/14 with radicals substituted by oxygen atoms
• CPC Class Codes: C07D 413/12 linked by a chain containing hetero atoms as chain links
• CPC Class Codes: C08G 61/00 Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule C08G2/00 - C08G16/00 take precedence
• CPC Class Codes: C08G 61/02 Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
• CPC Class Codes: C08G 73/02 Polyamines
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/29 of an individual layer connector
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/29324 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29344 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/29347 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/29355 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/29364 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/29369 : Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/29386 : with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/29388 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2224/29393 : with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
• CPC Class Codes: H01L 2224/73203 : Bump and layer connectors
• CPC Class Codes: H01L 2224/8385 : using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/293 : Organic, e.g. plastic
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01011 : Sodium [Na]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01056 : Barium [Ba]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04642 : SiC
• CPC Class Codes: H01L 2924/0503 : 13th Group
• CPC Class Codes: H01L 2924/05432 : Al2O3
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]

Abstract

An assembly of a semiconductor die attached to a substrate is made with a composition comprising compounds that contain an oxazoline functionality and an electron acceptor or an electron donor functionality. Electron donor functionalities include styrenic, cinnamyl, and vinyl ether groups. Electron acceptor functionalities include maleimide, acrylate, fumarate, and maleate groups. An exemplary compound has the structure: formula (I).

Claims

1. An assembly of a semiconductor die attached to a substrate with a composition consisting essentially of a compound having the structure,