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On die RFID tag antenna

  • US 7,528,724 B2
  • Filed: 02/28/2005
  • Issued: 05/05/2009
  • Est. Priority Date: 02/28/2005
  • Status: Active Grant
First Claim
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1. A semiconductor chip, comprising:

  • a) an active device area comprising transistors;

    b) a die seal ring substantially surrounding said active device area;

    c) a substrate beneath said active device area and die seal ring;

    d) an on-die antenna having wiring that;

    i) resides outside said active device area and die seal ring;

    ii) winds around said active device area and die seal ring;

    iii) is electrically isolated from said die seal ring; and

    ,e) a conductive path that runs from said on-die antenna to said active device area, wherein, at least a portion of said conductive path is embedded within said substrate, said conductive path being electrically coupled to;

    i) said wiring, and,ii) metal within said active device area;

    and wherein said embedded portion of said conductive path comprises an N doped well.

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