Microstructured component and method for its manufacture

• US 7,531,229 B2
• Filed: 07/14/2003
• Issued: 05/12/2009
• Est. Priority Date: 07/13/2002
• Status: Expired due to Fees

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Laermer, Franz, Gomez, Udo-Martin
• Primary Examiner(s): LONEY, DONALD J
• Application Number:
  US10/618,795
• Publication Number:
  US 20040081809A1
• Time in Patent Office: 2,129 Days
• Field of Search: 428/68, 428/76, 428/172, 257/691, 257/704, 257/724, 257/687, 303/119.3, 303/146, 73/493, 73/52, 732/04, 73/22, 735/040.2, 735/041.2, 735/143.5, 735/143.9, 340/438, 180/170, 188/180, 188/181.A
• US Class Current: 428/76
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/031 Anodic bondings
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: Y10T 428/239 Complete cover or casing
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

A microstructured component having a layered construction may allow implementation of component structures having a layer thickness of more than 50 μm, e.g., more than 100 μm. Capping of the component structure may allow vacuum enclosure of the component structure with a hermetically sealed electrical connection. The layered construction of the microstructured component includes a carrier including at least one glass layer, e.g., a PYREX™ layer, a component structure, arranged in a silicon layer, which is bonded to the glass layer, and a cap, which is positioned over the component structure and is also bonded to the glass layer.

Claims

1. A microstructured component having a layered construction, comprising:

a carrier including at least one glass layer;

a component structure including a first silicon layer directly bonded to the glass layer, the component structure including movable structure elements; and

a cap arranged over the component structure and bonded directly to the glass layer, wherein the component structure includes a first silicon wafer and is bonded to the glass layer by anodic bonding at a temperature of approximately 400°

C., wherein the first silicon layer has a thickness greater than 50 μ

m, wherein the cap is configured as a mechanical stop for the movable structure elements, wherein the component structure is enclosed in a vacuum between the glass layer and the cap, and wherein a pressure of the vacuum is approximately 100 μ

bar to 1 mbar.

2. The microstructured component of claim 1, wherein the first silicon wafer includes a (111)-silicon wafer.

3. The microstructured component of claim 1, wherein the cap includes a second silicon wafer and is bonded to the glass layer by anodic bonding.

4. The microstructured component of claim 1, further comprising conductor paths arranged to contact the component structure arranged between the glass layer and the component structure.

5. The microstructured component of claim 1, further comprising at least one electrically conductive shield arranged on the glass layer, at least part of the component structure electrically connected to the shield.

6. The microstructured component of claim 5, wherein the glass layer includes a structured metallization in which conductor paths and shields are arranged.

7. The microstructured component of claim 1, wherein the microstructured component is a yaw rate sensor.