Block-molded semiconductor device singulation methods and systems

• US 7,531,432 B2
• Filed: 02/14/2007
• Issued: 05/12/2009
• Est. Priority Date: 02/14/2007
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Arshad, Mohamad Ashraf Bin Mohd, Fatt, Yue Seng
• Primary Examiner(s): Lindsay, Jr.; Walter L
• Assistant Examiner(s): MUSTAPHA, ABDULFATTAH B
• Application Number:
  US11/674,862
• Publication Number:
  US 20080194081A1
• Time in Patent Office: 818 Days
• Field of Search: 438/112, 438/113, 438/464, 438/623, 257/E21.001, 257/666, 257/667, 257/664
• US Class Current: 438/460
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68331 of passive members, e.g. die mounting substrate
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: Y10T 83/222 With receptacle or support for cut product

Abstract

The invention discloses methods and systems for singulation of block-molded arrays of semiconductor devices. Preferred embodiments include methods and associated systems for securing a block-molded array of semiconductor devices into a mounting ring with light-sensitive tape. Tape-deactivating is used to render exposed regions of the light-sensitive tape less tacky. The mounting ring containing the block-molded array is secured on a cutting table and the array is singulated into individual devices. Aspects of the invention also include the use of tape-deactivating light for making the light-sensitive tape less tacky to facilitate removal of the individual devices after singulation.

Claims

1. A method for singulating block-molded arrays of semiconductor devices comprising the steps of:

providing a mounting ring for receiving a block-molded array of semiconductor devices;

placing a block-molded array of semiconductor devices into the mounting ring and securing the array to the mounting ring with light-sensitive tape;

exposing the array, mounting ring, and light-sensitive tape to tape-deactivating light, whereby the array acts to shield one or more regions of the light-sensitive tape from tape-deactivating light, and whereby one or more exposed regions of the light-sensitive tape are made less tacky by the action of the tape-deactivating light;

securing the mounting ring containing the secured array on a cutting table, the taped side of the array adjacent to the cutting table; and

cutting the array to singulate devices.

2. A method according to claim 1 further comprising the step of exposing the taped side of the sawn array to tape-deactivating light, whereby the light-sensitive tape is made less tacky by the action of the tape-deactivating light such that the singulated devices may be removed.

3. A method according to claim 1 wherein the step of providing a mounting ring further comprises providing a mounting ring configured for receiving a plurality of block-molded arrays, and wherein subsequent steps are performed with a plurality of block-molded arrays.

4. A method according to claim 1 wherein the step of securing the mounting ring further comprises using a vacuum to secure the mounting ring to the cutting table.

5. A method according to claim 1 wherein the step of cutting the array to singulate devices further comprises sawing.

6. A method according to claim 1 wherein the step of exposing the array, mounting ring, and light-sensitive tape to tape-deactivating light, further comprises exposure to UV light.

7. A method according to claim 1 wherein the step of exposing the array, mounting ring, and light-sensitive tape to tape-deactivating light, further comprises exposure to IR light.

8. A method according to claim 1 wherein the step of exposing the array, mounting ring, and light-sensitive tape to tape-deactivating light, further comprises exposure to visible light.

9. A method for singulating block-molded arrays of semiconductor devices comprising the steps of:

providing a mounting ring for receiving a block-molded array of semiconductor devices;

placing a block-molded array of semiconductor devices into the mounting ring and securing the array to the mounting ring with light-sensitive tape;

exposing the array, mounting ring, and light-sensitive tape to tape-deactivating light, whereby the array acts to shield one or more regions of the light-sensitive tape from tape-deactivating light, and whereby one or more exposed regions of the light-sensitive tape are made less tacky by the action of the tape-deactivating light;

securing the mounting ring containing the secured array on a cutting table, the taped side of the array adjacent to the cutting table;

cutting the array to singulate devices; and

exposing the taped side of the sawn array to tape-deactivating light, whereby the light-sensitive tape is made less tacky by the action of the tape-deactivating light such that the singulated devices may be removed.