Semiconductor device including a strained superlattice between at least one pair of spaced apart stress regions
First Claim
Patent Images
1. A semiconductor device comprising:
- at least one pair of spaced apart stress regions; and
a strained superlattice layer between said at least one pair of spaced apart stress regions and comprising a plurality of stacked groups of layers;
each group of layers of said strained superlattice layer comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions, and at least some semiconductor atoms from opposing base semiconductor portions being chemically bound together with the chemical bonds traversing the at least one non-semiconductor monolayer therebetween;
wherein the non-semiconductor is selected from the group consisting of at least one of oxygen, nitrogen, fluorine, and carbon.
5 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device may include at least one pair of spaced apart stress regions, and a strained superlattice layer between the at least one pair of spaced apart stress regions and including a plurality of stacked groups of layers. Each group of layers of the strained superlattice layer may include a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions.
161 Citations
27 Claims
-
1. A semiconductor device comprising:
-
at least one pair of spaced apart stress regions; and a strained superlattice layer between said at least one pair of spaced apart stress regions and comprising a plurality of stacked groups of layers; each group of layers of said strained superlattice layer comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions, and at least some semiconductor atoms from opposing base semiconductor portions being chemically bound together with the chemical bonds traversing the at least one non-semiconductor monolayer therebetween; wherein the non-semiconductor is selected from the group consisting of at least one of oxygen, nitrogen, fluorine, and carbon. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
-
18. A semiconductor device comprising:
-
at least one pair of source and drain stress regions; and a strained superlattice layer between said at least one pair of spaced apart source and drain stress regions and comprising a plurality of stacked groups of layers; each group of layers of said strained superlattice layer comprising a plurality of stacked base silicon monolayers defining a base silicon portion and at least one oxygen monolayer constrained within a crystal lattice of adjacent base silicon portions, and at least some silicon atoms from opposing base silicon portions being chemically bound together with the chemical bonds traversing the at least one oxygen monolayer therebetween. - View Dependent Claims (19, 20, 21, 22)
-
-
23. A semiconductor device comprising:
-
at least one pair of spaced apart stress regions; and a strained layer between said at least one pair of spaced apart stress regions and comprising a plurality of stacked base semiconductor portions and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions, and at least some semiconductor atoms from opposing base semiconductor portions being chemically bound together with the chemical bonds traversing the at least one non-semiconductor monolayer therebetween; wherein the non-semiconductor is selected from the group consisting of at least one of oxygen, nitrogen, fluorine, and carbon. - View Dependent Claims (24, 25, 26, 27)
-
Specification