Support structure for MEMS device and methods therefor
First Claim
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1. A method of making a microelectromechanical systems device, comprising:
- providing a substrate having a first electrode formed over the substrate;
forming at least one support structure of the device by forming a metal sacrificial material over the first electrode layer and oxidizing some portions of the sacrificial material;
forming a movable layer over the sacrificial material after forming the at least one support structure; and
creating a cavity between the substrate and the movable layer.
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Abstract
A microelectromechanical systems device having support structures formed of sacrificial material that is selectively diffused with a dopant material or formed of a selectively oxidized metal sacrificial material. The microelectromechanical systems device includes a substrate having an electrode formed thereon. Another electrode is separated from the first electrode by a cavity and forms a movable layer, which is supported by support structures formed of a diffused or oxidized sacrificial material.
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Citations
55 Claims
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1. A method of making a microelectromechanical systems device, comprising:
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providing a substrate having a first electrode formed over the substrate; forming at least one support structure of the device by forming a metal sacrificial material over the first electrode layer and oxidizing some portions of the sacrificial material; forming a movable layer over the sacrificial material after forming the at least one support structure; and creating a cavity between the substrate and the movable layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An unreleased interferometric modulator device, comprising:
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a substrate; a first electrode formed over the substrate; a layer formed over the first electrode, wherein the layer comprises a sacrificial portion formed of a metal and a support portion, wherein the support portion is an oxide of the metal; and a movable layer over the layer. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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27. A method of making a microelectromechanical systems device, comprising:
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providing a substrate having a first electrode layer formed over the substrate; forming at least one support structure by forming a sacrificial material over the first electrode layer and anodizing selected portions of the sacrificial material; and creating a cavity between the first electrode layer and a second electrode layer. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A method of making an interferometric modulator device, comprising:
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providing a substrate having a first electrode layer formed over the substrate; depositing a sacrificial material over the first electrode layer; and forming at least one support structure of the device by selectively diffusing a dopant material into the sacrificial material. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44, 45, 46)
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47. An unreleased interferometric modulator device, comprising:
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a substrate; a first electrode formed over the substrate; a layer formed over the first electrode, wherein the layer comprises a sacrificial portion formed of a material and a support portion, wherein the support portion comprises the material doped with a dopant material; and a movable layer over the layer. - View Dependent Claims (48, 49, 50)
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51. A method of making an interferometric modulator device, comprising:
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providing a substrate having a first electrode layer formed over the substrate; depositing a sacrificial material over the first electrode layer; and forming at least one support structure of the device by selectively implanting ions into the sacrificial material and using a laser to anneal implanted portions of the sacrificial material. - View Dependent Claims (52, 53, 54, 55)
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Specification