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Method for manufacturing a micro-electro-mechanical device

  • US 7,534,641 B2
  • Filed: 09/29/2005
  • Issued: 05/19/2009
  • Est. Priority Date: 09/29/2005
  • Status: Expired due to Fees
First Claim
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1. A method for manufacturing a micro-electro-mechanical (MEM) device, comprising the steps of:

  • providing a first wafer;

    removing a portion of the first wafer to provide a cavity including a plurality of spaced support pedestals within the cavity;

    bonding a second wafer to at least a portion of the first wafer, wherein a portion of the second wafer provides a diaphragm over the cavity, and wherein the support pedestals support the diaphragm during processing;

    etching the second wafer to release the diaphragm from the support pedestals; and

    etching at least a portion of the diaphragm adjacent a sidewall of the cavity to allow the diaphragm to move and to provide the (MEM) device that is compatible with a complementary metal-oxide semiconductor (CMOS) process wherein the support pedestals are spaced in a regular pattern such that the cavity is provided without creating stress limit at temperature.

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