Methods for hermetic sealing of post media-filled MEMS package

• US 7,534,662 B2
• Filed: 05/11/2005
• Issued: 05/19/2009
• Est. Priority Date: 02/19/2004
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Michael, Donald, Chen, Chien-Hua, Haluzak, Charles C.
• Primary Examiner(s): Menz; Douglas M
• Assistant Examiner(s): Fulk; Steven J
• Application Number:
  US11/127,915
• Publication Number:
  US 20050202591A1
• Time in Patent Office: 1,469 Days
• Field of Search: 438/126, 257/684, 257/E23.098
• US Class Current: 438/126
• CPC Class Codes: B81C 1/00285 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid

Abstract

This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.

Claims

1. A method for hermetically sealing a post media-filled micro-electro-mechanical system (MEMS) package, comprising the steps of:

filling a MEMS package through a fill port with at least one liquid medium;

plugging the fill port in the MEMS package containing the at least one liquid medium with a sealant; and

depositing a metal cap in a specific pattern over the sealant to hermetically seal the fill port, wherein the metal cap is deposited through a shadow mask defining a specific pattern, at least a portion of the metal cap extending into the fill port, including depositing a metal film in a specific pattern on top of the sealant using physical vapor deposition through the shadow mask.

2. The method of claim 1, wherein the step of filling the MEMS package includes the more specific step of filling the MEMS package through the fill port that is a through hole located in a lid.

3. The method of claim 1, wherein the step of filling a MEMS package includes the more specific step of filling the MEMS package through the fill port that is a break in a bond ring.

4. The method of claim 1, wherein the step of filling a MEMS package includes the more specific step of filling the MEMS package with at least one liquid medium from the group consisting of a low vapor pressure oil, a lubricant, a hydrophobic fluid, and sol gel.

5. The method of claim 1, wherein the step of filling a MEMS package includes the more specific step of evacuating the MEMS package atmosphere to create a vacuum prior to filling the MEMS package with the at least one liquid medium.

6. The method of claim 1, wherein the step of plugging the fill port includes the more specific step of plugging the fill port with an organic sealant.

7. The method of claim 1, wherein the step of plugging the fill port with an organic sealant includes the more specific step of placing one or more sealants within the fill hole, wherein the sealant is an organic sealant selected from the group consisting of thermal-set epoxy, UV curable epoxy, two-part epoxy, silicone, and spin-on polyamides.

8. The method of claim 1, wherein the step of plugging the fill port includes the more specific step of plugging the fill port with an inorganic sealant.

9. The method of claim 1, further comprising the step of curing the sealant used in plugging the fill port.

10. The method of claim 1, wherein the step of curing the sealant includes the more specific step of curing the sealant with a curing agent.

11. The method of claim 1, wherein the step of curing the sealant includes the more specific step of curing the sealant with a curing agent from the group consisting of ethylene amines and cycloaliphatics.

12. The method of claim 1, wherein the step of curing the sealant includes the more specific step of curing the sealant with using a vacuum.

13. The method of claim 1, further comprising the step of cleaning the MEMS package.

14. A method for hermetically sealing a post media-filled micro-electro-mechanical system (MEMS) package, comprising the steps of:

filling a MEMS package through a fill port with at least one liquid medium;

plugging the fill port in the MEMS package containing the at least one liquid medium with a sealant; and

depositing a metal cap in a specific pattern over the sealant to hermetically seal the fill port, wherein the metal cap is deposited through a shadow mask defining a specific pattern, at least a portion of the metal cap extending into the fill port, including depositing a metal film in a specific pattern on top of the sealant using an electron beam through the shadow mask.