Photocuring resin composition containing organic polymer having epoxy group and/or oxetane group-containing silicon group at end, and method for producing same

• US 7,534,820 B2
• Filed: 03/13/2006
• Issued: 05/19/2009
• Est. Priority Date: 09/18/2003
• Status: Expired due to Fees

• Current Assignee: Kaneka Corporation
• Original Assignee: Kaneka Corporation
• Inventors: Ando, Hiroshi, Kohno, Yoshiyuki
• Primary Examiner(s): Berman; Susan W
• Application Number:
  US11/373,306
• Publication Number:
  US 20070066699A1
• Time in Patent Office: 1,163 Days
• Field of Search: 522/148, 522/31, 522/66, 528/25, 528/40, 528 13- 18, 528/29
• US Class Current: 522/31
• CPC Class Codes: C08F 10/10 Isobutene
• CPC Class Codes: C08F 8/42 Introducing metal atoms or metal-containing groups
• CPC Class Codes: C08G 18/56 Polyacetals
• CPC Class Codes: C08G 59/3254 containing atoms other than carbon, hydrogen, oxygen or nitrogen
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/06 containing silicon bound to oxygen-containing groups C08L83/12 takes precedence
• CPC Class Codes: G03F 7/038 Macromolecular compounds which are rendered insoluble or differentially wettable G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021
• CPC Class Codes: G03F 7/0757 Macromolecular compounds containing Si-O, Si-C or Si-N bonds G03F7/0752 takes precedence

Abstract

The present invention provides a novel photocurable composition containing an organic polymer having an epoxy group and/or oxetane group-containing silicon group at an end and a cationic photoinitiator. For example, the photocurable composition contains an organic polymer (A) having an epoxy group and/or oxetane group-containing silicon group at an end, and a cationic photoinitiator (B), the organic polymer (A) being produced by addition reaction between an organic polymer terminated with an unsaturated group and a hydrosilane compound having an epoxy group and/or an oxetane group.

Claims

1. A photocurable composition containing an organic polymer (A) having a structure represented by formula (1), (2), or (3), and a cationic photoinitiator (B):

2. The photocurable composition according to claim 1, wherein X of the organic polymer (A) has a structure represented by formula (4):

3. The photocurable composition according to claim 1, wherein X of the organic polymer (A) has a structure represented by formula (5):

4. The photocurable composition according to claim 1, wherein X of the organic polymer (A) has a structure represented by formula (6):

5. The photocurable composition according to claim 1, wherein the organic polymer (A) is produced by reaction between an organic polymer having an unsaturated group at an end and a hydrosilane compound, and the hydrosilane compound contains an epoxy group and/or an oxetane group.

6. The photocurable composition according to claim 1, wherein the organic polymer (A) is produced by hydrolyzable group exchange reaction between an organic polymer having a hydrolyzable silyl group at an end and a compound having one hydroxyl group per molecule, and the compound having one hydroxyl group per molecule contains at least one epoxy group and/or oxetane group.

7. The photocurable composition according to claim 1, wherein the cationic photoinitiator (B) has a structure represented by formula (7):

[R⁷_aR⁸_bR⁹_cR¹⁰_dW]^u+[MZ_v+u]^u−

 

 

(7)

wherein W represents S, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, Ti, Zr, Fe, Ru, Os, or N≡

N; and

R⁷, R⁸, R⁹, and R¹⁰ are the same or different and each represent an organic group;

a, b, c, and d each represent an integer of 0 to 3, and (a+b+c+d) equals to the valence of W;

M represents a metal or matalloid constituting a center atom of a complex [MZ_v+u] and selected from B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, and Co;

Z represents a halogen atom or an organic group which is a ligand coordinating to M;

u represents the net electric charge of the complex ion; and

v represents the valence of M.

8. The photocurable composition according to claim 1, wherein the cationic photoinitiator (B) is selected from onium salts, diaryliodonium salts of sulfonic acid, triarylsulfonium salts of sulfonic acid, diaryliodonium salts of boronic acid, and triarylsulfonium salts of boronic acid.

9. The photocurable composition according to claim 1 further containing at least one selected from epoxy group-containing compounds and/or epoxy group-containing oligomers (C) and oxetane group-containing compounds and/or oxetane group-containing oligomers (D).

10. A method for producing a cured product, wherein the photocurable composition according to claim 1 is irradiated with a light energy source to obtain a cured product.

11. A cured product obtained by the method according to claim 10.

12. A product containing the cured product according to claim 11 as a component.