Systems and methods for thermal sensing

• US 7,535,020 B2
• Filed: 06/28/2005
• Issued: 05/19/2009
• Est. Priority Date: 06/28/2005
• Status: Active Grant

• Current Assignee: International Business Machines Corporation, Kioxia Corporation
• Original Assignee: International Business Machines Corporation, Sony Computer Entertainment Incorporated (Sony Group Corp.), Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Stasiak, Daniel, Johns, Charles R., Yazawa, Kazuaki, Wang, Michael F., Takiguchi, Iwao, Tamura, Tetsuji, Kihara, Hiroki, Yoshida, Munehiro
• Primary Examiner(s): Warren; Matthew E
• Application Number:
  US11/168,591
• Publication Number:
  US 20060289862A1
• Time in Patent Office: 1,421 Days
• Field of Search: 257/48, 257/467, 257/E29.347, 257/E23.179
• US Class Current: 257/48
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Systems and methods for positioning thermal sensors within an integrated circuit in a manner that provides useful thermal measurements corresponding to different parts of the integrated circuit. In one embodiment, an integrated circuit includes multiple, duplicate functional blocks. A separate thermal sensor is coupled to each of the duplicate functional blocks, preferably in the same relative location on each of the duplicate functional blocks, and preferably at a hotspot. One embodiment also includes thermal sensors on one or more functional blocks of other types in the integrated circuit. One embodiment includes a thermal sensor positioned at a cool spot, such as at the edge of the integrated circuit chip. Each of the thermal sensors may have ports to enable power and ground connections or data connections between the sensors and external components or devices.

Claims

1. A system comprising:

an integrated circuit having a plurality of duplicate processor cores;

a first set of thermal sensors, wherein each of the first set of thermal sensors is coupled to a corresponding one of the duplicate processor cores and positioned at the same location on the corresponding one of the duplicate processor cores;

control circuitry coupled to each of the thermal sensors in the first set, wherein the control circuitry is configured to independently adjust operation of each of the processor cores based on a corresponding temperature signal received from the thermal sensor coupled to the processor core; and

an additional thermal sensor that is positioned at a cool spot of the integrated circuit.

2. The system of claim 1, wherein the additional thermal sensor is positioned at an edge of the integrated circuit.

3. The system of claim 1, further comprising

one or more ports coupled to the thermal sensors, wherein the ports enable electrical signals to be communicated directly between the thermal sensors and one or more off-chip electrical components.

4. The system of claim 3, wherein each port is coupled to no more than two of the thermal sensors.

5. The system of claim 4, wherein each port is coupled to only one of the thermal sensors.

6. The system of claim 3, wherein each port is coupled to one or more power and ground lines in the corresponding thermal sensors and configured to enable the coupling of the power and ground lines to external power and ground connections.

7. The system of claim 3, wherein each port is coupled to one or more input/output lines in the corresponding thermal sensors and configured to enable the coupling of the input/output lines to external signal lines.

8. A system comprising:

an integrated circuit having a plurality of duplicate processor cores, wherein each of the duplicate processor cores is functionally identical to the other duplicate processor cores;

a first set of thermal sensors, wherein each of the first set of thermal sensors is coupled to a corresponding one of the duplicate processor cores and positioned at the same location on the corresponding one of the duplicate processor cores;

control circuitry coupled to each of the thermal sensors in the first set, wherein the control circuitry is configured to independently adjust operation of each of the processor cores based on a corresponding temperature signal received from the thermal sensor coupled to the processor core; and

an additional thermal sensor that is positioned at a cool spot of the integrated circuit.

9. The system of claim 8, wherein each of the first set of thermal sensors is positioned at a hotspot of the corresponding one of the duplicate processor cores.

10. The system of claim 8, further comprising one or more additional functional blocks of types that are different from the duplicate processor cores and a second set of thermal sensors, wherein each of the second set of thermal sensors is coupled to a corresponding one of the additional functional blocks.

11. The system of claim 8, wherein each of the first set of thermal sensors is implemented entirely on the integrated circuit.