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System and method of integrating optics into an IC package

  • US 7,535,071 B2
  • Filed: 03/25/2005
  • Issued: 05/19/2009
  • Est. Priority Date: 03/29/2004
  • Status: Expired due to Fees
First Claim
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1. A multi-chip module (“

  • MCM”

    ) for detecting at least one light source, comprising;

    an integrated package that is essentially transparent relative to the wavelength of said light source;

    a substrate mounted within said n integrated package;

    a sensor, mounted on said substrate within said n integrated package;

    an opaque mask, coupled to said integrated package, said opaque mask having an aperture formed thereon, wherein an optical path is formed from said light source to said sensor through said opaque mask;

    an analog filter and amplification module (“

    AFA”

    ) coupled to said integrated package, said AFA being disposed to filter and amplify signals from said sensor and generate a second signal; and

    a digital signal processor (“

    DSP”

    ) coupled to said integrated package and said AFA, said DSP being adapted to generate a coordinate system by extracting frequency components from said second signal.

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