System and method of integrating optics into an IC package
First Claim
1. A multi-chip module (“
- MCM”
) for detecting at least one light source, comprising;
an integrated package that is essentially transparent relative to the wavelength of said light source;
a substrate mounted within said n integrated package;
a sensor, mounted on said substrate within said n integrated package;
an opaque mask, coupled to said integrated package, said opaque mask having an aperture formed thereon, wherein an optical path is formed from said light source to said sensor through said opaque mask;
an analog filter and amplification module (“
AFA”
) coupled to said integrated package, said AFA being disposed to filter and amplify signals from said sensor and generate a second signal; and
a digital signal processor (“
DSP”
) coupled to said integrated package and said AFA, said DSP being adapted to generate a coordinate system by extracting frequency components from said second signal.
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Accused Products
Abstract
An apparatus and method of integrating optics into an IC package is for detecting light from at least one light source is disclosed. The apparatus has a housing, which has a predetermined spectral transmittance. A sensor is positioned within the housing. An opaque mask is applied to the housing, where the opaque mask has a hole aligned with the sensor such that the light'"'"'s centroid is detected by the sensor. In one embodiment, the apparatus further comprises a substrate for positioning and stabilizing the sensor in the housing, an analog filter and amplification module (“AFA”) for filtering and amplifying signals from the sensor and generating a second signal, and a digital signal processor (“DSP”) for generating a coordinate system by extracting frequency components from the AFA output signal.
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Citations
14 Claims
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1. A multi-chip module (“
- MCM”
) for detecting at least one light source, comprising;an integrated package that is essentially transparent relative to the wavelength of said light source; a substrate mounted within said n integrated package; a sensor, mounted on said substrate within said n integrated package; an opaque mask, coupled to said integrated package, said opaque mask having an aperture formed thereon, wherein an optical path is formed from said light source to said sensor through said opaque mask; an analog filter and amplification module (“
AFA”
) coupled to said integrated package, said AFA being disposed to filter and amplify signals from said sensor and generate a second signal; anda digital signal processor (“
DSP”
) coupled to said integrated package and said AFA, said DSP being adapted to generate a coordinate system by extracting frequency components from said second signal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
- MCM”
Specification
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- Resources
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Current AssigneeiRobot Corporation
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Original AssigneeEvolution Robotics Inc. (iRobot Corporation)
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InventorsSchell, Steve, Brown, Joe, Witman, Robert
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Primary Examiner(s)Chu; Chris C.
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Application NumberUS11/090,432Publication NumberTime in Patent Office1,516 DaysField of Search257/E31.122, 257/E31.117, 257/434, 257/680, 257/681, 235454-546, 235/380, 250/203.3, 250/203.5, 702/150, 348/230.1, 348/345, 348/349, 348/354, 348/340, 348/294US Class Current257/434CPC Class CodesH01L 2224/48137 the bodies being arranged n...H01L 27/14618 ContainersH01L 31/0203 Containers; Encapsulations ...H01L 31/02164 for shielding light, e.g. l...
