Security techniques for electronic devices

• US 7,535,373 B2
• Filed: 12/06/2005
• Issued: 05/19/2009
• Est. Priority Date: 07/15/2005
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Dalzell, William J.
• Primary Examiner(s): Bugg; George A
• Assistant Examiner(s): LAU, HOI CHING
• Application Number:
  US11/295,837
• Publication Number:
  US 20070013538A1
• Time in Patent Office: 1,260 Days
• Field of Search: 340/5.65, 340/652, 340/657, 340/635, 340/590, 340/545.5, 235/492, 701/71, 385/115, 385/120, 713/194
• US Class Current: 340/652
• CPC Class Codes: G08B 13/128 the housing being an electronic circuit unit, e.g. memory or CPU chip protecting computer components in secure or tamper resistant housings G06F21/86; protecting computer input devices, e.g. keyboards G06F21/83

Abstract

Systems and methods for protecting electronic and other sensitive devices in the event of security breaches such as physical intrusion or access, tampering, and attempts at reverse engineering. One aspect of the present invention provides security systems and methods that utilize an active security measure that can identify a security breach and respond with a protective action. Protective actions may include erasure or randomizing of data or software, activation of an alarm or signal (such as at a remote location), or destruction of any portion of a protected device or circuit or the like.

Claims

1. A secure electronic system comprising an electronic device, the electronic device comprising electronic circuitry and a thin-film security layer integrated with at least a portion of the electronic circuitry so that physical access of said portion of the electronic circuitry causes an identifiable change in a characteristic of the thin-film security layer, wherein the thin-film security layer comprises a material with an optically responsive characteristic and wherein physical access of said portion of the electronic circuitry causes a change in an optical property of the material with an optically responsive characteristic.

2. The system of claim 1, wherein the thin-film security layer covers at least a portion of said portion of the electronic circuitry.

3. The system of claim 1, wherein said physical access includes at least one of mechanical, chemical, and optical access.

4. The system of claim 1, further comprising a signal-based communication link between the electronic circuitry and the thin-film security layer.

5. The system of claim 1, wherein the electronic circuitry comprises a response device that can be activated in response to the identifiable change in a characteristic of the thin-film security layer.

6. The system of claim 5, wherein the response device comprises at least one of a thermal battery and a communication device.

7. A method of securing an electronic device against unauthorized access, the method comprising the steps of:

providing an electronic device having electronic circuitry; and

integrating a thin-film security layer with at least a portion of the electronic circuitry in a manner effective to generate an identifiable change in a characteristic of the thin-film security layer in response to an event indicative of unauthorized access to said portion of the electronic circuitry, wherein the thin-film security layer comprises a material with an optically responsive characteristic and wherein the identifiable change in a characteristic of the thin-film security layer is a change in an optical property the material with an optically responsive characteristic.

8. The method of claim 7, wherein the step of integrating a thin-film security layer with at least a portion of the electronic circuitry comprises coating said portion of the electronic circuitry with the thin-film layer by a deposition process.

9. The method of claim 8, wherein the deposition process comprises one of chemical vapor deposition and combustion chemical vapor deposition.

10. The method of claim 8, wherein the deposition process comprises a vacuum deposition process.

11. The method of claim 8, further comprising controlling the temperature of said portion of the electronic circuitry during the deposition process.

12. The method of claim 8, further comprising coating said portion of the electronic circuitry with at least one of a buffer layer and a bonding layer before coating said portion of the electronic circuitry with the thin-film layer.

13. A method of securing an electronic device against unauthorized access, the method comprising the steps of:

providing an electronic device having electronic circuitry and a thin-film security layer integrated with at least a portion of the electronic circuitry;

causing an identifiable change in a characteristic of the thin-film security layer in response to unauthorized access to said portion of the electronic circuitry; and

initiating a security action in response to the identifiable change in a characteristic of the thin-film security layer, wherein the thin-film security layer comprises a material with an optically responsive characteristic and wherein the identifiable change in a characteristic of the thin-film security layer is a change in an optical property of the material with an optically responsive characteristic.

14. The method of claim 13, wherein the step of initiating a security action comprises establishing communication with a monitoring device.

15. The method of claim 13, wherein the step of initiating a security action comprises at least one of erasing and randomizing said portion of the electronic circuitry.

16. The method of claim 13, wherein the step of initiating a security action comprises activating a response device.

17. The method of claim 16, wherein the response device comprises at least one of a thermal battery and a transponder.