Lead receptacle and pin frame assembly

• US 7,537,474 B2
• Filed: 07/12/2007
• Issued: 05/26/2009
• Est. Priority Date: 07/12/2007
• Status: Expired due to Fees

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Deininger, Steve T., Clayton, Jeffrey J.
• Primary Examiner(s): Duverne; Jean F
• Application Number:
  US11/776,733
• Publication Number:
  US 20090017668A1
• Time in Patent Office: 684 Days
• Field of Search: 439/218, 439/346, 439/222, 439/82, 439/140, 439/583, 439/651, 439/814
• US Class Current: 439/218
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: H01R 12/592 connections to contact elements

Abstract

A method includes (i) placing about a first alignment pin a first lead receptacle having a conductive portion, and (ii) placing about a second alignment pin a second lead receptacle having a conductive portion. The method further includes placing the first and second lead receptacles on a restraining fixture and attaching and electrically coupling a first conductor of a one piece lead frame pin assembly to the conductive portion of the first receptacle. The lead frame pin assembly has a tab element connecting the first conductor to a second conductor. The first and second conductors each include a feedthrough coupling portion. The method also includes attaching and electrically coupling the second conductor of the lead frame assembly to the conductive portion of the second receptacle. The lead receptacle and pin assembly may be inserted into a connector header.

Claims

1. A method comprising:

placing about a first alignment pin a first lead receptacle having a conductive portion;

placing about a second alignment pin a second lead receptacle having a conductive portion;

placing the first and second lead receptacles on a restraining fixture;

attaching and electrically coupling a first conductor of a one-piece lead frame pin assembly to the conductive portion of the first receptacle,

wherein the lead frame pin assembly has a tab element connecting a first conductor to a second conductor, the first conductor including a feedthrough coupling portion, and the second conductor including a feedthrough coupling portion; and

attaching and electrically coupling the second conductor of the lead frame assembly to the conductive portion of the second receptacle.

2. The method of claim 1, wherein placing the first lead receptacle about the first alignment pin comprises assembling components of the first receptacle on the first alignment pin, and wherein placing the second lead receptacle about the second alignment pin comprises assembling components of the second receptacle on the second alignment pin.

3. The method of claim 1, wherein attaching and electrically coupling the first conductor to the conductive portion of the first receptacle comprises welding the first conductor to the conductive portion of the first receptacle, and wherein attaching and electrically coupling the second conductor to the conductive portion of the second receptacle comprises welding the second conductor to the conductive portion of the second receptacle.

4. The method of claim 1, further comprising:

inserting the first and second lead receptacles with attached lead frame pin assembly into a connector block header housing such that the first and second receptacles are received by first and second recesses of the header housing; and

securing the first and second lead receptacles to the header housing.

5. The method of claim 4, further comprising:

removing the tab element.

6. The method of claim 5, further comprising:

electrically coupling feedthrough coupling portion of the first conductor to a first and feedthrough of an implantable medical device, and electrically coupling the feedthrough coupling portion of the second conductor to a second feedthrough of the implantable medical device.

7. The method of claim 6, further comprising:

attaching the header housing to the device housing.

8. The method of claim 7, further comprising:

removing the first and second alignment pins from the first and second lead receptacles.

9. A lead receptacle and pin assembly comprising:

first and second lead receptacles, each having a conductive portion; and

a one-piece lead frame pin assembly attached to the conductive portions of the first and second lead receptacles,

wherein the one-piece lead frame pin assembly comprises first and second conductors connected via a tab element, the first conductor having (i) a receptacle coupling portion that is attached and electrically coupled to the conductive portion of the first lead receptacle and (ii) a feedthrough coupling portion configured to be electrically coupled to a first feedthrough of an implantable medical device,

the second conductor having (i) a receptacle coupling portion that is attached and electrically coupled to the conductive portion of the first lead receptacle and (ii) a feedthrough coupling portion configured to be electrically coupled to a second feedthrough of the implantable medical device.

10. The lead receptacle and pin assembly of claim 9, wherein the tab element is removably attached to the feedthrough coupling portions of the first and second conductors.

11. The lead receptacle and pin assembly of claim 10, wherein the pin assembly comprises more than two conductors, each having a feedthrough coupling portion, and wherein the tab element is removably attached to each of the feedtrhough coupling portions.

12. The lead receptacle and pin assembly of claim 9, wherein the tab element is removable along a line of weakening.

13. The lead receptacle and pin assembly of claim 9, wherein the pin assembly is substantially planar.

14. A connector header assembly comprising:

a housing defining first and second recesses; and

the lead receptacle and pin assembly of claim 9,

wherein the first receptacle is disposed in the first recess and the second receptacle is disposed in the second recess.

15. The connector header assembly of claim 14, wherein the header housing is formed of a plastic material having a modulus of greater than 200 ksi.

16. The connector header assembly of claim 9, wherein the header housing is formed of polysulfone.