Device and method for manufacturing the same

• US 7,537,963 B2
• Filed: 05/12/2006
• Issued: 05/26/2009
• Est. Priority Date: 11/28/2003
• Status: Active Grant

• Current Assignee: Sensotherm Temperatursensorik GmbH (TE Connectivity Ltd. (United Kingdom))
• Original Assignee: Georg Bernitz, Heinrich Zitzmann
• Inventors: Bernitz, Georg, Zitzmann, Heinrich
• Primary Examiner(s): Toledo; Fernando L
• Application Number:
  US11/433,613
• Publication Number:
  US 20060214267A1
• Time in Patent Office: 1,110 Days
• Field of Search: 438/107, 438/108, 438/110
• US Class Current: 438/110
• CPC Class Codes: G01K 7/16 using resistive elements resistive elements per se H01C, H01L
• CPC Class Codes: H01C 1/142 the terminals or tapping points being coated on the resistive element
• CPC Class Codes: H01C 17/006 adapted for manufacturing resistor chips
• CPC Class Codes: H01C 17/281 by thick film techniques
• CPC Class Codes: H01C 7/001 Mass resistors
• CPC Class Codes: H01G 13/006 Apparatus or processes for applying terminals
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In a method for manufacturing a device, at first a plurality of components each having at least a first terminal region are provided. Furthermore, a support with a first surface, in which a plurality of recesses are formed, is provided. The components provided are inserted into the recesses such that the first terminal region of each component faces the first surface of the support. Conductive material is applied on the first surface of the support such that the conductive material is in contact with the first terminal region of each component. Finally, the support is diced to obtain the individual devices.

Claims

1. A method for manufacturing devices, comprising the steps of:

providing a plurality of components, each component having;

a body with;

a first main surface;

a second main surface opposing the first main surface;

a first end face;

a second end face opposing the first end face, the first and second end faces connecting the two opposing main surfaces to each other;

a first side surface; and

a second side surface opposing the first side surface, the first and second side surfaces connecting the two opposing main surfaces to each other; and

a first terminal formed at the first end face at a first end of the body;

providing a support having a first surface and a plurality of recesses formed in the support to extend from the first surface into the support;

inserting each of the plurality of components into a respective one of the plurality of recesses, each component being positioned so that its respective first main surface is perpendicular to the first surface of the support such that the first terminal of each of the plurality of components faces the first surface of the support;

applying a conductive material on the first surface of the support such that the conductive material is in contact with the first terminal of each of the plurality of components; and

dicing the support to obtain the individual devices.

2. The method of claim 1, wherein

each of the components further comprise a second terminal formed at the second end face at a second end of the body, the second end of the body opposing the first end of the body;

the recesses in the support extend from the first surface to a second surface opposing the first surface; and

the components are inserted in the recesses such that the first terminal faces the first surface and the second terminal faces the second surface;

wherein the method further comprises the step of;

applying a conductive material on the second surface of the support such that the conductive material is in contact with the second terminal of each component.

3. The method of claim 1, comprising the step of:

burning-in the conductive material.

4. The method of claim 1, further comprising the step of:

generating the plurality of devices from the support with the components arranged therein, such that a dimension of each device is greater than that of the inserted component, and a terminal region of the device is greater than the first and second terminals region of the component.

5. The method of claim 4, wherein dicing the support includes splitting the support or punching the support.

6. The method of claim 1, wherein the recess in the support is generated by mechanical or chemical treatment.

7. The method of claim 1, wherein the support includes non-conductive material selected from the group including glass, ceramics, unburned ceramic material, epoxy, or polyimide, or including conductive material with a non-conductive surface.

8. The method of claim 1, wherein the conductive material includes platinum, gold, silver, nickel or conductive glue.

9. The method of claim 1, wherein the component provided includes a temperature sensor.

10. A method for manufacturing devices, comprising the steps of:

providing a plurality of components, each component having;

a body with;

a first main surface;

a second main surface opposing the first main surface;

a first end face;

a second end face opposing the first end face, the first and second end faces connecting the two opposing main surfaces to each other;

a first side surface; and

a second side surface opposing the first side surface, the first and second side surfaces connecting the two opposing main surfaces to each other;

a first terminal formed at the first end face at a first end of the body;

a second terminal formed at the second end face at a second end of the body opposing the first end of the body;

providing a support having a first surface and a plurality of recesses formed in the support to extend from the first surface through the support to a second surface opposing the first surface;

inserting each of the plurality of components into a respective one of the recesses with their main surface being perpendicular to the first and second surfaces of the support such that the first terminal of each of the plurality of components faces the first surface of the support and the second terminal of each of the plurality of components faces the second surface;

applying a conductive material on the first surface of the support such that the conductive material is in contact with the first terminal of each of the plurality of components;

applying a conductive material on the second surface of the support such that the conductive material is in contact with the second terminal of each of the plurality of components and

dicing the support to obtain the individual devices.