Method of fabricating a miniature silicon condenser microphone
First Claim
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1. A method for producing a MEMS transducer, the method comprising:
- providing a substrate, the substrate comprising a first insulating layer, a first conductive layer, and an aperture;
coupling a transducer to the substrate overlapping the aperture to form at least a portion of a cavity for the transducer;
providing and attaching a cover to the substrate to enclose and protect the transducer, the cover comprising a second insulating layer and a second conductive layer; and
joining the first conductive layer and the second conductive layer to form a shield against electromagnetic interference.
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Abstract
A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.
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Citations
24 Claims
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1. A method for producing a MEMS transducer, the method comprising:
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providing a substrate, the substrate comprising a first insulating layer, a first conductive layer, and an aperture; coupling a transducer to the substrate overlapping the aperture to form at least a portion of a cavity for the transducer; providing and attaching a cover to the substrate to enclose and protect the transducer, the cover comprising a second insulating layer and a second conductive layer; and joining the first conductive layer and the second conductive layer to form a shield against electromagnetic interference. - View Dependent Claims (2, 3, 4, 5)
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6. A method for producing a MEMS transducer, the method comprising:
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providing a substrate; providing and coupling a transducer to the substrate; providing and joining a cover to the substrate to form a housing, the housing defining an interior portion in which the transducer is disposed; and forming an aperture within the housing acoustically coupling the interior portion to an exterior portion of the housing for receiving a signal; and electrically shielding the transducer by associating with the housing an inner lining on a surface of the inner portion, the inner lining being a conductive material such that the conductive material provides an effective shield against electromagnetic interference. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method for producing a MEMS transducer, the method comprising:
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providing a printed circuit board comprising at least one layer of conductive material and at least one layer of insulating material; providing a cover comprising at least one layer of conductive material; providing and cooperating a spacer to the cover and the printed circuit board to form a housing, the spacer comprising a sidewall at least partially covered by a conductive layer, the conductive layer including a portion of an inner lining for providing a shield against an electromagnetic interference; forming an aperture within the housing adapted for receiving a signal; and mounting a transducer within the housing.
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22. A method for producing a MEMS transducer, the method comprising:
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providing a substrate including an upper surface having a recess formed within, the substrate comprising a layer of conductive material; mounting a transducer to the upper surface overlapping at least a portion of the recess so that a back volume is formed between the transducer and the substrate; placing a cover over the transducer, the cover comprising an aperture and a layer of conductive material; providing and cooperating a spacer to the cover and the substrate to form a housing, the spacer comprising a conductive material; and wherein the conductive layers electrically coupled to form an inner lining for providing a shield against an electromagnetic interference; providing a sealing ring, the sealing ring formed on a surface of the substrate opposite the upper surface adjacent the back volume.
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23. A method of producing a MEMS transducer, the method comprising:
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providing a printed circuit board, the printed circuit board comprises at least one layer of a conductive material and at least one layer of an insulating material; providing and coupling a transducer to the printed circuit board; providing and joining a cover to the printed circuit board to form a housing, the housing defining an interior portion in which the transducer is disposed, and the cover comprises a conductive portion; forming an aperture within the housing acoustically coupling the interior portion to an exterior portion of the housing for receiving a signal; providing a spacer, the spacer comprises a conductive portion, disposing the spacer between the printed circuit board and the cover; and electrically shielding the transducer comprises electrically coupling the conductive layer and the conductive portions to form a shield against electromagnetic interference.
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24. A method of producing a MEMS transducer, the method comprising:
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providing a printed circuit bard, the printed circuit board comprises at least one layer of a conductive material and at least one layer of an insulating material; providing and coupling a transducer to the printed circuit board; providing and joining a cover to the printed circuit to form a housing, the housing defining an interior portion in which the transducer is disposed, and the cover comprises a conductive portion; forming an aperture within the housing acoustically coupling the interior portion to an exterior portion of the housing for receiving a signal; providing a spacer, the spacer comprises a conductive portion, disposing the spacer between the printed circuit board and the cover; and electrically shielding the transducer comprises providing a conductive adhesive to electrically couple the conductive layer and the conductive portions to form a shield against electromagnetic interference.
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Specification