Methods and apparatus for utilizing an optical reference

• US 7,538,564 B2
• Filed: 10/18/2006
• Issued: 05/26/2009
• Est. Priority Date: 10/18/2005
• Status: Active Grant

• Current Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Original Assignee: GSI Group Corporation (Novanta Inc.)
• Inventors: Zink, Jens, Duffy, Patrick S., Weber, Markus M., Metzger, Gregg A., Ehrmann, Jonathan S., Mabboux, Pierre-Yves, Chu, Yun Fee, Lento, Joseph V.
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): BENITEZ ROSARIO, JOSHUA
• Application Number:
  US11/582,829
• Publication Number:
  US 20070096763A1
• Time in Patent Office: 951 Days
• Field of Search: 324/158.1, 324751-758, 35613904-13908, 356399-401, 356/490, 356/508, 356/614, 356/622
• US Class Current: 324/754.23
• CPC Class Codes: B23K 26/032 using optical means
• CPC Class Codes: B23K 26/042 Automatically aligning the laser beam
• CPC Class Codes: B23K 26/0861 in at least in three axial directions
• CPC Class Codes: B23K 26/351 for trimming or tuning of electrical components
• CPC Class Codes: B23K 26/705 Beam measuring device
• CPC Class Codes: G01R 31/2891 related to sensing or controlling of force, position, temperature G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05

Abstract

A laser processing system implements a method for aligning a probe element (e.g., a probe pin) with a device interface element (e.g., a contact pad of a circuit substrate). First, the laser processing system generates an optical reference beam at one or more predetermined positions to calibrate a reference field. The laser processing system then detects a position of the probe element in the reference field. The laser processing system also determines a relative position of the device interface element in the reference field. Based on the position of the probe element and the device interface element, the laser processing system then initiates alignment of the probe element and the device interface element. In one application, alignment of the probe element and the device interface element further includes contacting the probe element to the device interface element to make an electrical connection.

Claims

1. A method, comprising:

positioning a wafer-based device in a reference field;

determining a relative position of a second element in the reference field, the second element being a device interface element of the wafer-based device;

generating an optical reference beam that intersects a predetermined position in the reference field, including;

generating a laser processing beam and propagating the laser beam along an optical path that intersects the reference field; and

attenuating the laser processing beam;

detecting a relative position of a first element in the reference field, the first element being a probe element; and

aligning the first element to the second element, including aligning the device interface element within the reference field to the probe element based on the detected position of the probe element in the reference field and the determined position of the device interface element, and

processing material of the wafer-based device with the laser processing beam;

wherein determining the relative position of the device interface element to the reference field further comprises;

detecting a position of reference features carried with the device interface element with respect to the reference field, and

determining the position of the device interface element based on the position of the detected reference features and a predetermined position of the device interface element with respect to the reference feature;

and wherein a predetermined position of the device interface element with respect to the reference feature is one of;

the position of the device interface element in a map of a wafer including both reference feature positions and device interface element positions, or

a position of a device interface element measured in relation to a reference feature;

and wherein determining the position of the device interface element based on the position of the detected reference features and a predetermined position of the device interface element with respect to the reference feature includes;

utilizing a first camera with at least one field of view positioned in the reference field to detect the position of the reference features carried with the device interface element in the reference field;

and wherein detecting the position of the probe element in the reference field with respect to the position of the optical reference beam includes;

i) positioning the optical reference beam at a predetermined location in the reference field;

ii) positioning a field of view of a second camera within the reference field;

iii) forming an image of the optical reference beam in the field of view while the optical reference beam is at the predetermined location in the reference field;

iv) forming an image of one or more tips of probe pins associated with a probe card in the field of view, the probe element being one of the one or more probe pins;

v) determining the position of the image of the optical reference beam in the field of view; and

vi) determining the position of at least one probe pin tip in the field of view.

2. A method, comprising:

positioning a wafer-based device in a reference field;

determining a relative position of a second element in the reference field, the second element being a device interface element of the wafer-based device;

generating an optical reference beam that intersects a predetermined position in the reference field, including;

generating a laser processing beam and propagating the laser beam along an optical path that intersects the reference field; and

attenuating the laser processing beam;

detecting a relative position of a first element in the reference field, the first element being a probe element; and

aligning the first element to the second element, including aligning the device interface element within the reference field to the probe element based on the detected position of the probe element in the reference field and the determined position of the device interface element, and

processing material of the wafer-based device with the laser processing beam;

wherein;

determining the relative position of the device interface element to the reference field includes utilizing a first imaging system viewing the reference features from a first side of the reference field to determine the position in the reference field of reference features carried on a device substrate; and

detecting the position of the probe element in the reference field with respect to the position of the optical reference beam includes utilizing a second imaging system viewing the probe element in the reference field from a second side of the reference field to detect the position of the probe element in the reference field, the second imaging system being rigidly mounted to a movable assembly that carries the substrate upon which the device interface element and reference features reside, and wherein the second side of the reference field is the reverse side of the first side of the reference field.

3. A method as in claim 2, wherein utilizing a second imaging system to detect the relative position of the probe element in the reference field includes initiating movement of the movable assembly to position the second imaging system for imaging the probe element, and wherein the method further comprises:

moving the movable assembly to a predetermined position to position a field of view of the second imaging system in the reference field;

imaging a probe element in the reference field and based on the image; and

determining the position of the probe element in the reference field.

4. A method, comprising:

positioning a wafer-based device in a reference field;

determining a relative position of a second element in the reference field, the second element being a device interface element of the wafer-based device;

generating an optical reference beam that intersects a predetermined position in the reference field, including;

generating a laser processing beam and propagating the laser beam along an optical path that intersects the reference field; and

attenuating the laser processing beam;

detecting a relative position of a first element in the reference field, the first element being a probe element; and

aligning the first element to the second element, including aligning the device interface element within the reference field to the probe element based on the detected position of the probe element in the reference field and the determined position of the device interface element, and

processing material of the wafer-based device with the laser processing beam;

wherein detecting the position of the probe element in the reference field is with respect to the position of the optical reference beam and includes utilizing an imaging system including at least one camera and high and low magnification imaging elements rigidly mounted to a movable assembly to detect the relative position of the probing element in the reference field, the movable assembly carrying a substrate upon which the device interface element resides, and wherein the method further comprises;

initiating movement of the movable assembly to view the probe element with the low magnification imaging elements; and

initiating movement of the movable assembly based on a low magnification image to view the probe element with the high magnification imaging elements, the high magnification imaging elements being rigidly mounted adjacent to the low magnification imaging elements.

5. A method as in claim 4, further comprising:

illuminating the probe element coaxially through the high magnification imaging element; and

illuminating the probe element with a ring light encircling the axis of the low magnification imaging optical path.

6. A method, comprising:

positioning a wafer-based device in a reference field;

determining a relative position of a second element in the reference field, the second element being a device interface element of the wafer-based device;

generating an optical reference beam that intersects a predetermined position in the reference field, including;

generating a laser processing beam and propagating the laser beam along an optical path that intersects the reference field; and

attenuating the laser processing beam;

detecting a relative position of a first element in the reference field, the first element being a probe element; and

aligning the first element to the second element, including aligning the device interface element within the reference field to the probe element based on the detected position of the probe element in the reference field and the determined position of the device interface element, and

processing material of the wafer-based device with the laser processing beam;

wherein determining the relative position of the device interface element to the reference field includes;

i) utilizing a laser beam positioner system to position a field of view of a first camera to at least one location in the reference field; and

ii) utilizing the first camera to detect the position of the reference features carried with the device interface element in the reference field.

7. A method as in claim 6, wherein detecting the position of the probe element in the reference field with respect to the position of the optical reference beam includes:

i) utilizing the laser beam positioner system to position the optical reference beam to intersect a predetermined location in the reference field;

ii) positioning a field of view of a second camera in the reference field and forming an image of the optical reference beam with the second camera while the optical reference beam is intersecting the predetermined location in the reference field;

iii) determining the position of the image of the optical reference beam in the second camera field of view;

iv) positioning the field of view of the second camera in the reference field and forming an image of one or more probe pin tips associated with a probe card with the second camera, the probe element being one of the one or more probe pins; and

v) determining the position of at least one probe pin tip in the second camera field of view.

8. A method as in claim 7, wherein forming an image of one or more probe pin tips associated with a probe card with the second camera further comprises:

illuminating the probe pin tip and forming the image with a telecentric objective having a numerical aperture of about 0.18 or more.

9. A method as in claim 7, wherein forming an image of one or more probe pin tips associated with a probe card with the second camera further comprises:

illuminating the probe pin tip from the field of view of the first camera with an illuminator coaxial with the field of view of the first camera thereby backlighting the probe pin.

10. A method as in claim 7, wherein forming an image of one or more probe pin tips associated with a probe card with the second camera further comprises:

illuminating the probe pin tip with a ring light and forming the image with a 1×

objective.

11. A method as in claim 7, wherein positioning a field of view of a second camera in the reference field and forming an image of the optical reference beam while the optical reference beam is at the predetermined location in the reference field includes:

initiating movement of the second camera to view the probe element in the reference field;

based at least in part on at least one of;

i) an amount of movement of the second camera to view the probe element, and ii) a position of the probe element in the reference field, determining a difference between the relative position of the probe element and an expected position of the probe element; and

aligning the device interface element with the probe element based on the difference between the relative position of the probe element and an expected position of the probe element.

12. A method as in claim 11, wherein aligning the device interface element to the probe element includes adjusting a position of at least one of the probe element and the device interface element by an amount specified by the difference in order for the probe element to contact the device interface element.

13. A method as in claim 7, wherein aligning the device interface element within the reference field to the probe element includes automatically moving at least one of the probe card and the device interface element to precisely contact the one or more probe pins of the probe card to one or more device interface elements, the device interface element being a contact pad of a device.

14. A method as in claim 7, wherein forming an image of the optical reference beam with the second camera is forming and image of a focused or a defocused laser beam, wherein the laser beam wavelength is infrared, visible, or ultraviolet and wherein the camera is sensitive to the laser wavelength.

15. A method, comprising:

positioning a wafer-based device in a reference field;

determining a relative position of a second element in the reference field, the second element being a device interface element of the wafer-based device;

generating an optical reference beam that intersects a predetermined position in the reference field, including;

generating a laser processing beam and propagating the laser beam along an optical path that intersects the reference field; and

attenuating the laser processing beam;

detecting a relative position of a first element in the reference field, the first element being a probe element; and

aligning the first element to the second element, including aligning the device interface element within the reference field to the probe element based on the detected position of the probe element in the reference field and the determined position of the device interface element, and

processing material of the wafer-based device with the laser processing beam;

wherein;

the first element is a first contact element, and the second element is a second contact element;

determining a relative position of the second element in a reference field is based on use of a first imaging system;

generating an optical reference beam that intersects a predetermined position in the reference field is to align a second imaging system;

detecting a relative position of the first element in the reference field is based on use of the second imaging system; and

aligning the first element to the second element is based on the relative position of the first element and the relative position of the second element in the reference field.

16. A method as in claim 15, wherein aligning the first contact element to the second contact element further comprises initiating movement of at least one of the first contact element and the second contact element to touch the first contact element to the second contact element and form an electrical connection between test equipment and a circuit under test, including:

initiating movement of at least one of;

i) a probe card to which the first contact element is attached, the first contact element being a pin on the probe card, and ii) a circuit substrate to which the second contact element is attached, the second contact element being a test pad associated with a circuit under test on the circuit substrate;

utilizing a source that generates the optical reference beam to generate a laser beam that is applied to the circuit under test; and

trimming a component of the circuit under test with the applied laser beam.

17. A method as in claim 15, wherein determining the relative position of the second contact element in the reference field includes:

utilizing the first imaging system to identify a pattern of multiple pads on a circuit substrate, the second contact element being one of multiple contact pads on a circuit substrate;

and wherein detecting the relative position of the first contact element includes;

i) utilizing the laser beam positioner system to position the optical reference beam to a specific location in the reference field to align a camera associated with the second imaging system;

ii) initiating movement of the camera for viewing the optical reference beam while the optical reference beam is in the specific location in the reference field; and

iii) utilizing the camera to identify a pattern of multiple probe pins associated with a probe card, the first contact element being one of the multiple probe pins on the probe card.

18. A method as in claim 15, wherein:

determining the relative position of the second contact element in the reference field includes viewing the second contact element from a first side of the reference field; and

detecting the relative position of the first contact element in the reference field includes moving a camera associated with the second imaging system, the camera being rigidly mounted to a movable assembly that retains a circuit substrate upon which the second contact element resides and viewing the first contact element in the reference field from a second side of the reference field utilizing the camera, the second side of the reference field being opposite the first side of the reference field.

19. A method as in claim 15, wherein detecting the relative position of the first contact element in the reference field includes utilizing the second imaging system, which is rigidly mounted to a movable assembly, to identify the relative position of the first contact element in the reference field, the movable assembly retaining a circuit substrate upon which the second contact element resides, and wherein the method further comprises:

initiating movement of the movable assembly to view the first contact element with a low magnification camera of the second imaging system; and

initiating movement of the movable assembly to view the first contact element with a high magnification camera of the second imaging system, the high magnification camera being rigidly mounted adjacent to the low magnification camera on the movable assembly.

20. A method, comprising:

positioning a wafer-based device in a reference field;

determining, based on use of a first imaging system, a relative position of a second contact element in the reference field, the second contact element being a test pad associated with a circuit under test on the wafer-based device;

generating an optical reference beam that intersects a predetermined position in the reference field, to align a second imaging system;

detecting a relative position of a first contact element in the reference field, based on use of the second imaging system, the first contact element being a pin on a probe card;

aligning the first contact element to the second contact element based on the relative position of the first contact element and the relative position of the second contact element in the reference field, the aligning including initiating movement of at least one of the first contact element and the second contact element to touch the first contact element to the second contact element and form an electrical connection between test equipment and the circuit under test, including;

(a) initiating movement of at least one of;

i) the probe card, and ii) the wafer-based device; and

(b) utilizing a source that generates the optical reference beam to generate a laser beam that is applied to the circuit under test; and

trimming a component of the circuit under test with the applied laser beam.

21. A method as in claim 20, wherein determining the relative position of the second contact element in the reference field includes:

utilizing the first imaging system to identify a pattern of multiple pads on the circuit substrate, the second contact element being one of multiple contact pads on a circuit substrate;

and wherein detecting the relative position of the first contact element includes;

i) utilizing the laser beam positioner system to position the optical reference beam to a specific location in the reference field to align a camera associated with the second imaging system;

ii) initiating movement of the camera for viewing the optical reference beam while the optical reference beam is in the specific location in the reference field; and

iii) utilizing the camera to identify a pattern of multiple probe pins associated with a probe card, the first contact element being one of the multiple probe pins on the probe card.

22. A method as in claim 20, wherein:

determining the relative position of the second contact element in the reference field includes viewing the second contact element from a first side of the reference field; and

detecting the relative position of the first contact element in the reference field includes moving a camera associated with the second imaging system, the camera being rigidly mounted to a movable assembly that retains a circuit substrate upon which the second contact element resides and viewing the first contact element in the reference field from a second side of the reference field utilizing the camera, the second side of the reference field being opposite the first side of the reference field.

23. A method as in claim 20, wherein detecting the relative position of the first contact element in the reference field includes utilizing the second imaging system, which is rigidly mounted to a movable assembly, to identify the relative position of the first contact element in the reference field, the movable assembly retaining a circuit substrate upon which the second contact element resides, and wherein the method further comprises:

initiating movement of the movable assembly to view the first contact element with a low magnification camera of the second imaging system; and

initiating movement of the movable assembly to view the first contact element with a high magnification camera of the second imaging system, the high magnification camera being rigidly mounted adjacent to the low magnification camera on the movable assembly.