High density integrated circuit apparatus, test probe and methods of use thereof

• US 7,538,565 B1
• Filed: 08/25/1999
• Issued: 05/26/2009
• Est. Priority Date: 10/19/1992
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Lauro, Paul Alfred, Shih, Da-Yuan, Walker, George Frederick, Fogel, Keith Edward, Beaman, Brian Samuel, Norcott, Maurice Heathcote
• Primary Examiner(s): Nguyen; Vinh P
• Application Number:
  US09/382,834
• Time in Patent Office: 3,562 Days
• Field of Search: 324754-762, 324/765, 439/482, 439/824, 296/28, 298/74, 298/40
• US Class Current: 324/755.11
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/0675 Needle-like
• CPC Class Codes: G01R 1/07307 with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07371 using an intermediate card or back card with apertures through which the probes pass
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45155 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/45164 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/78301 : Capillary
• CPC Class Codes: H01L 2224/85205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/85214 : using a laser
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5384 : Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/1627 : stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/20756 : larger or equal to 60 microns less than 70 microns
• CPC Class Codes: H01L 2924/20757 : larger or equal to 70 microns less than 80 microns
• CPC Class Codes: H01L 2924/20758 : larger or equal to 80 microns less than 90 microns
• CPC Class Codes: H01L 2924/20759 : larger or equal to 90 microns less than 100 microns
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: Y10S 29/029 : Molding with other step
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base
• CPC Class Codes: Y10T 29/49162 : by using wire as conductive path
• CPC Class Codes: Y10T 29/49192 : with insulation removal
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate

Abstract

A high density test probe which provides an apparatus for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

Claims

1. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with a surface of the electronic component;

the flexible contact elements flex and wipe the surface of the electronic component when the flexible contacts contact the electronic components;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component; and

at least one of the flexible contact elements includes a protuberance at an end thereof.

2. A method according to claim 1, wherein the area is a plurality of integrated circuits on the semiconductor wafer;

and the flexible contacts make contact with the plurality of die sites all at once.

16. A method according to any one of claims 1, 3, 5, 7, 9, 11, 14, or 4 to 15 wherein the flexible conductors comprise a coating.

17. A structure according to claim 16 wherein said coating is selected from the group consisting of Au, Cr, Co, Ni and Pd.

18. A structure according to claim 17 wherein said free standing flexible conductor comprises gold, gold alloy, copper, copper alloy, aluminum, nickel, palladium and platinum.

20. A method according to any one of claims 1, 3, 5, 7, 9, 13 or 19 wherein the protuberance comprises a surface having a portion which is substantially spherical.

21. A method according to any one of claims 1, 3, 5, 7, 9, 13 or 19 wherein the protuberance comprises a substantially planar surface.

22. A method according to any one of claims 1, 3, 5, 7, 9, 11, 14 or 4 to 15, wherein the electronic component is a semiconductor wafer.

23. A method according to any one of claims 1, 3, 5, 7, 9, 11, 14 or 4 to 15, wherein the area of the electronic component is a portion of a surface area of the electronic component.

24. A method according to any one of claims 1, 3, 5, 7, 9, 11, 14 or 4 to 15, wherein the flexible elements are probe elements.

25. A method according to any one of claims 1, 3, 5, 7, 9, 11, 14 or 4 to 15, wherein there are electrical connections between the second substrates and the first Substrate.

26. A method according to any one of claims 1, 3, 5, 7, 9, 11, 14 or 4 to 15, wherein the first substrate is a space transformer.

27. A method according to any one of claims 1, 3, 5, 7, 9, 11, 14 or 4 to 15, wherein the electronic component is a semiconductor wafer;

and the flexible contact elements of the second substrate contact individual semiconductor dies on the semiconductor wafer.

28. A method according to any one of claims 1, 3, 5, 7, 9, 11, 14 or 4 to 15, wherein the electronic component is a semiconductor wafer;

and the flexible contact Elements of the second substrate contacts at least one integrated circuit on the semiconductor Wafer.

29. A method according to any one of claims 1, 3, 5, 7, 9, 11, 14 or 4 to 15, wherein the first substrate with the second substrate mounted thereto is mounted to an Electrical testing apparatus by a plurality of electrical connections.

30. A method according to any one of claims 1, 3, 5, 7, 9, 11, 14 or 4 to 15, wherein there is at least one second substrate is mounted to said first substrate.

3. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with the electronic component, and the electronic component is a printed circuit board; and

at least one of the flexible contact elements includes a protuberance at an end thereof.

4. A method according to claim 3 where each of said plurality of flexible contact elements flex and wipe the area of the electronic component when said flexible contacts contact the electronic component;

the flexible contact element substantially compliantly respond when the flexible contact element are withdrawn from contacting the electronic component.

5. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with the electronic component, and the electronic component is a packaging substrate; and

at least one of the flexible contact elements includes a protuberance at an end thereof.

6. A method according to claim 5 where each of said plurality of flexible contact elements flex and wipe the area of the electronic component when said flexible contacts contact the electronic component;

the flexible contact element substantially compliantly respond when the flexible contact element are withdrawn from contacting the electronic component.

7. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with the electronic component, and at least one of the flexible contact elements includes a protuberance at an end thereof.

8. A method according to claim 7 where each of said plurality of flexible contact elements flex and wipe the area of the electronic component when said flexible contacts contact the electronic component;

the flexible contact element substantially compliantly respond when the flexible contact element are withdrawn from contacting the electronic component.

9. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with the electronic component, and the flexible elements are wires disposed on the surface of the second substrate, the wires are shaped so that a free end thereof laterally moves when pressed against the area of the electronic component; and

at least one of the flexible contact elements includes a protuberance at an end thereof.

10. A method according to claim 9 where each of said plurality of flexible contact elements flex and wipe the area of the electronic component when said flexible contacts contact the electronic component;

the flexible contact element substantially compliantly respond when the flexible contact element are withdrawn from contacting the electronic component.

11. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

urging the first substrate and the electronic device towards one another so that the flexible contact elements make contact with the electronic component so that a free end of the flexible contact elements laterally move when pressed against the area of the electronic device, and the second substrate is aligned to the first substrate by a socket which electrically interconnects the first substrate and the second substrate in a substantially fixed position with respect to each other.

12. A method according to claim 11 where each of said plurality of flexible contact elements flex and wipe the area of the electronic component when said flexible contacts contact the electronic component;

the flexible contact element substantially compliantly respond when the flexible contact element are withdrawn from contacting the electronic component.

13. A method according to claim 11 wherein at least one of the flexible contact elements further include a protuberance at an end thereof.

14. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with the electronic component so that a free end of the flexible contact elements laterally move when pressed against the area of the electronic device, and the first substrate with the second substrate mounted thereto is mounted to an electrical testing apparatus.

15. A method according to claim 14 where each of said plurality of flexible contact elements flex and wipe the area of the electronic component when said flexible contacts contact the electronic component;

the flexible contact element substantially compliantly respond when the flexible contact element are withdrawn from contacting the electronic component.

19. A method according to claim 14 wherein at least one of the flexible contact elements further includes a protuberance at an end thereof.

31. A method of probing an electronic component by contacting the electronic device with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with a surface of the electronic component;

the flexible contact elements flex and wipe the surface of the electronic component when the flexible contacts contact the electronic components;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

the electronic component is a semiconductor wafer; and

the flexible contact elements of the second substrate contact individual semiconductor dies on the semiconductor wafer.

35. A method according to any one of claims 31 to 33 or 34 where each of said plurality of flexible contact elements flex and wipe the area of the electronic component when said flexible contacts contact the electronic component;

the flexible contact element substantially compliantly respond when the flexible contact element are withdrawn from contacting the electronic component.

32. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with the electronic component, and the first substrate comprises a printed circuit board; and

the electronic component is a semiconductor wafer; and

the flexible contact elements of the second substrate contact individual semiconductor dies on the semiconductor wafer.

33. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with the electronic component, and the second substrate comprises is a packaging substrate; and

the electronic component is a semiconductor wafer; and

the flexible contact elements of the second substrate contact individual semiconductor dies on the semiconductor wafer.

34. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with the electronic component, and the flexible elements are wires disposed on the surface of the second substrate, the wires are shaped so that a free end thereof laterally moves when pressed against the area of the electronic component; and

the electronic component is a semiconductor wafer; and

the flexible contact elements of the second substrate contact individual semiconductor dies on the semiconductor wafer.

36. A method of probing an electronic component by contacting the electronic device with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with a surface of the electronic component;

the flexible contact elements flex and wipe the surface of the electronic component when the flexible contacts contact the electronic components;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component; and

the electronic component is a semiconductor wafer; and

the flexible contact elements of the second substrate contacts at least one integrated circuit on the semiconductor wafer.

40. A method according to any one of claims 36 to 38 or 39 where each of said plurality of flexible contact elements flex and wipe the area of the electronic component when said flexible contacts contact the electronic component;

the flexible contact element substantially compliantly respond when the flexible contact element are withdrawn from contacting the electronic component.

37. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with the electronic component, and the first substrate comprises a printed circuit board; and

the electronic component is a semiconductor wafer; and

the flexible contact elements of the second substrate contacts at least one integrated circuit on the semiconductor wafer.

38. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with the electronic component, and the second substrate comprises is a packaging substrate; and

the electronic component is a semiconductor wafer; and

the flexible contact elements of the second substrate contacts at least one integrated circuit on the semiconductor wafer.

39. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:

providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;

mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;

the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component;

urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with the electronic component, and the flexible elements are wires disposed on the surface of the second substrate, the wires are shaped so that a free end thereof laterally moves when pressed against the area of the electronic component; and

the electronic component is a semiconductor wafer; and

the flexible contact elements of the second substrate contacts at least one integrated circuit on the semiconductor wafer.