Electrical component tuned by conductive layer deletion

• US 7,538,652 B2
• Filed: 08/29/2006
• Issued: 05/26/2009
• Est. Priority Date: 08/29/2006
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Jenkins, Keith A., Meghelli, Mounir
• Primary Examiner(s): Nguyen; Tuyen T.
• Application Number:
  US11/512,014
• Publication Number:
  US 20080055036A1
• Time in Patent Office: 1,001 Days
• Field of Search: 336/65, 336/83, 336/84.R, 336/84.C, 336/200, 336/232, 257/531
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2021/125 Printed variable inductor with taps, e.g. for VCO
• CPC Class Codes: H01F 21/12 discontinuously variable, e.g. tapped
• CPC Class Codes: H01F 41/045 Trimming
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/165 incorporating printed inductors

Abstract

Techniques are disclosed for fabricating tunable electrical components in integrated circuits. For example, a method of tuning a value of an electrical component, such as a planar inductor, includes the steps of placing a conductive layer in proximity of the electrical component, and adjusting an amount of material that constitutes the conductive layer such that the value of the electrical component is tuned to a particular value. The adjustment step may be performed so as to select a frequency band with which the inductor is associated or to correct a manufacturing deviation in a frequency with which the inductor is associated.

Claims

1. A method of tuning a value of an electrical component, comprising the steps of:

placing a conductive layer in proximity of the electrical component; and

adjusting an amount of material that comprises the conductive layer such that the value of the electrical component is tuned to a particular value;

wherein the conductive layer comprises a patterned metal level; and

wherein the patterned metal level comprises a plurality of concentric loops.

2. The method of claim 1, wherein the placing step further comprises placing the conductive layer above the electrical component.

3. The method of claim 1, wherein the conductive layer and the electrical component are part of an integrated circuit.

4. The method of claim 3, wherein the adjusting step is performed during a manufacturing process or a post-manufacturing process of the integrated circuit.

5. The method of claim 1, wherein the adjusting step further comprises removing an amount of material of the conductive layer such that the value of the electrical component is tuned to a particular value.

6. The method of claim 5, wherein the removing step further comprises performing a laser ablation operation to remove the amount of material.

7. The method of claim 5, wherein the removing step further comprises performing an etching operation to remove the amount of material.

8. The method of claim 1, wherein the adjusting step further comprises altering at least one of the plurality of concentric loops by forming an opening in the loop.

9. The method of claim 1, wherein the electrical component is an inductor.

10. The method of claim 9, wherein the inductor is a planar spiral inductor.

11. The method of claim 1, wherein the adjustment step is performed so as to select a frequency band with which the inductor is associated.

12. The method of claim 1, wherein the adjustment step is performed to correct a manufacturing deviation in a frequency with which the inductor is associated.

13. A method of tuning an inductance value of a planar spiral inductor in an integrated circuit device, comprising the steps of:

positioning a tuning metal above the planar spiral inductor; and

removing a portion of the tuning metal during manufacture of the integrated circuit device such that the inductance value of the planar spiral inductor is tuned to a particular inductance value;

wherein the tuning metal comprises a patterned metal level; and

wherein the patterned metal level comprises a plurality of concentric loops.

14. The method of claim 13, wherein the removing step further comprises performing a laser ablation operation to remove the portion of the tuning metal.

15. The method of claim 13, wherein the removing step further comprises performing an etching operation to remove the portion of the tuning metal.

16. The method of claim 13, wherein the removing step further comprises altering at least one of the plurality of concentric loops by forming an opening in the loop.