Electronic control enclosure

• US 7,542,294 B2
• Filed: 03/12/2007
• Issued: 06/02/2009
• Est. Priority Date: 10/19/2004
• Status: Active Grant

• Current Assignee: Cinch Connectors Incorporated (Bel Connector Incorporated)
• Original Assignee: Cinch Connectors Incorporated (Bel Connector Incorporated)
• Inventors: Kostic, Bratislav, Rachwalski, Thaddeus Michael John, Caines, Arturo
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US11/716,915
• Publication Number:
  US 20070153484A1
• Time in Patent Office: 813 Days
• Field of Search: None
• US Class Current: 361/704
• CPC Class Codes: H05K 5/0039 having a tubular housing wherein the PCB is inserted longitudinally
• CPC Class Codes: H05K 5/061 sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
• CPC Class Codes: H05K 7/2049 Pressing means used to urge contact, e.g. springs
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence

Abstract

The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.

Claims

1. An electronic control enclosure comprising:

an enclosure housing defining an interior chamber accessible through an opening;

a header assembly including a plurality of terminals, the header assembly enclosing and environmentally sealing the opening; and

a heat sink disposed through the enclosure housing, the heat sink including an interior surface exposed to the interior chamber and an exterior surface exposed to an exterior of the enclosure housing, the enclosure housing including a plastic material.

2. The electronic control enclosure of claim 1, further comprising an electronic component inserted into the interior chamber wherein the electronic component includes an exposed heat transfer surface in thermal contact with the interior surface.

3. The electronic control enclosure of claim 2 further comprising a spring, the spring urges the heat transfer surface toward the interior surface.

4. The electronic control enclosure of claim 3, wherein the enclosure housing includes an embossment, the spring engages the embossment.

5. The electronic control enclosure of claim 3 wherein the enclosure housing includes a locator and a recess, the locator is received in the recess.

6. The electronic control enclosure of claim 1 wherein the header assembly is made of metal.

7. The electronic control enclosure of claim 1, wherein the header assembly includes a front plate and a heat sink rail extending from the front plate, the enclosure housing receiving the header assembly such that the heat sink rail is located in the interior chamber and the front plate is located in the opening.

8. The electronic control enclosure of claim 7 further comprising an electrical component having an exposed heat transfer surface mounted to the heat sink rail, and a substrate having a conductive trace, the substrate extending from the front plate and the electrical component and substrate are located in the interior chamber.

9. The electronic control enclosure of claim 2 wherein the enclosure housing includes an embossment projecting into the interior chamber.

10. The electronic control enclosure of claim 9 wherein the electronic component is received at a location between the embossment and the heat sink.

11. The electronic control enclosure of claim 9 wherein the embossment includes an edge generally parallel to and spaced apart from the interior surface, the edge having a step dividing the edge into a first edge portion and a second edge portion, the first edge portion spaced a greater distance from the interior surface than the second edge portion.

12. The electronic control enclosure of claim 9 further comprising a substrate assembly including a substrate having a conductive trace, the electronic component being mounted to the substrate, and wherein when the substrate is inserted into the interior chamber, the embossment urges the electronic component toward the heat sink.

13. The electronic control enclosure of claim 3 wherein the spring is a spring plate.

14. The electronic control enclosure of claim 13 wherein the spring plate comprises an engagement element for contacting the electronic component.

15. The electronic control enclosure of claim 13 wherein the spring plate comprises a spacer element for disposal between the electronic component and a second electronic component.

16. The electronic control enclosure of claim 4 wherein the spring comprises a compression feature for engaging the embossment.

17. A method of making an electronic control enclosure comprising:

providing an enclosure housing defining an interior chamber for protectively housing electronic components;

providing a header assembly including a plurality of terminals;

providing a substrate including a plurality of electronic components, each having a heat transfer surface;

inserting the substrate in the interior chamber so that the electronic components are aligned to a heat sink, the heat sink including an interior surface exposed to the interior chamber and an exterior surface exposed to an exterior of the enclosure housing; and

urging the heat transfer surface against the heat sink with a spring.

18. A method of making an electronic control enclosure comprising:

providing an enclosure housing defining an interior chamber;

providing a header assembly including a face plate and projecting heat sink rails, the heat sink rails having a generally L-shaped cross-section with a first leg and a second leg, the first leg and the second leg projecting generally perpendicular to the face plate; and

inserting the header assembly into the interior chamber such that the face plate is received in an opening of the enclosure housing.

19. An electronic control enclosure comprising:

an enclosure housing defining an interior chamber accessible through an opening, the enclosure housing including an embossment projecting into the interior chamber;

a header assembly including a plurality of terminals, the header assembly enclosing and environmentally sealing the opening;

a heat sink in at least one of the enclosure housing and the header assembly, the heat sink including an interior surface exposed to the interior chamber and an exterior surface exposed to an exterior of the enclosure housing; and

an electronic component disposed within the interior chamber, the electronic component being disposed between the embossment and the heat sink, the electronic component including a heat transfer surface, and the heat transfer surface being in contact with the heat sink.

20. A method of making an electronic control enclosure comprising:

providing an enclosure housing defining an interior chamber for protectively housing an electronic component, the enclosure housing including an embossment projecting into the interior chamber;

providing a substrate including an electronic component, the electronic component having a heat transfer surface;

inserting the substrate in the interior chamber so that the electronic component is aligned to a heat sink, the heat sink including an interior surface exposed to the interior chamber and an exterior surface exposed to an exterior of the enclosure housing, the electronic component being disposed between the embossment and the heat sink; and

urging the heat transfer surface against the heat sink with a spring.