Encapsulated electrical component and production method
First Claim
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1. A method of manufacturing a micro-electro-mechanical systems (MEMS) component, the method comprising:
- producing a plurality of frame structures on a panel, each of the plurality of frame structures for enclosing a chip installation site;
connecting, via bumps, a plurality of chips to the panel at installation sites, at least one of the plurality of chips having a back side containing active components; and
using a jet-printing process to apply a jet-printed structure that substantially closes a gap between the frame structure and the plurality of chips;
wherein a fluid and curable resin, a melted polymer, or a dispersion containing nanoparticles is used to produce the jet-printed structure.
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Abstract
A micro-electro-mechanical systems (MEMS) component includes a panel, a chip having an underside containing active component structures, where the chip is mounted on the panel via bumps, a frame structure on the panel and enclosing an installation site of the chip, and a jet-printed structure closing a seam between frame structure and chip. The jet-printed structure has an upper edge that is above a lower edge of the chip.
67 Citations
18 Claims
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1. A method of manufacturing a micro-electro-mechanical systems (MEMS) component, the method comprising:
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producing a plurality of frame structures on a panel, each of the plurality of frame structures for enclosing a chip installation site; connecting, via bumps, a plurality of chips to the panel at installation sites, at least one of the plurality of chips having a back side containing active components; and using a jet-printing process to apply a jet-printed structure that substantially closes a gap between the frame structure and the plurality of chips; wherein a fluid and curable resin, a melted polymer, or a dispersion containing nanoparticles is used to produce the jet-printed structure. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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2. A method of manufacturing a micro-electro-mechanical systems (MEMS) component, the method comprising:
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producing a plurality of frame structures on a panel, each of the plurality of frame structures for enclosing a chip installation site; connecting, via bumps, a plurality of chips to the panel at the installation site, at least one of the plurality of chips having a back side containing active components; and using a jet-printing process to apply a jet-printed structure that substantially closes a gap between the frame structure and the plurality of chips; wherein a fluid and curable resin is printed as a dispersion containing nanoparticles to produce the jet-printed structure.
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Specification