Chip-scale coils and isolators based thereon

• US 7,545,059 B2
• Filed: 02/09/2007
• Issued: 06/09/2009
• Est. Priority Date: 10/23/1997
• Status: Expired due to Fees

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Chen, Baoxing, Kliger, Ronn
• Primary Examiner(s): Deberadinis; Robert L.
• Application Number:
  US11/704,459
• Publication Number:
  US 20080030080A1
• Time in Patent Office: 851 Days
• Field of Search: 307/412
• US Class Current: 307/412
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 19/08 Transformers having magnetic bias, e.g. for handling pulses
• CPC Class Codes: H01F 2019/085 Transformer for galvanic isolation
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/5222 Capacitive arrangements or effects of, or between wiring layers other capacitive arrangements H01L23/642
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H03H 7/52 One-way transmission networks, i.e. unilines
• CPC Class Codes: H04B 5/266 One coil at each side, e.g. with primary and secondary coils
• CPC Class Codes: H04B 5/75 for isolation purposes
• CPC Class Codes: H04L 25/0266 Arrangements for providing Galvanic isolation, e.g. by means of magnetic or capacitive coupling

Abstract

Coil structures and isolators using them. A coil(s) is (are) used as a magnetic field-generating element(s) paired with another coil(s) or other magnetic field-receiving element(s). The coil(s) is(are) formed in or on a substrate which does not include some or all of the driver (i.e., input) or receiver (i.e., output) circuits. The coil(s) and magnetic field-receiving element(s) thus can be manufactured separately from the driver and/or receiver circuitry, using different processes, instead of subjecting the chip areas containing both input and output circuits to post processing to form the coil(s). Isolators can be assembled using such coils with a resultant lower cost. Isolators also can be assembled using transformers made from such coils wherein the transformers can be driven on either of their windings in order to provide bi-directional isolation with a single transformer.

Claims

1. A signal isolator comprising:

a first substrate;

a first transformer formed on the first substrate including a first bottom winding and a second top winding;

an input circuit operatively connected to drive the second winding of the transformer in response to a received input signal;

an output circuit operatively connected to receive a signal from the first winding responsive to the drive from said input circuit and to generate an output signal responsive to said signal received from the first winding;

a second input circuit operatively connected to drive the first winding; and

a second output circuit operatively connected to receive a signal from the second winding responsive to the drive from the second input circuit,

wherein at least one of the input circuits and one of the output circuits are not formed on the first substrate.

2. The signal isolator of claim 1 wherein the first winding is disposed on the first substrate and the second winding is disposed above the first winding and electrically insulated from the first winding.

3. The signal isolator of claim 1 wherein at least one of the input circuit and the output circuit is formed in or on a semiconductor substrate which is not the first substrate.

4. The signal isolator of claim 3 wherein the input circuit is formed in or on a first semiconductor substrate and the output circuit is formed in or on a second semiconductor substrate.

5. The signal isolator of claim 4 wherein either the first semiconductor substrate or the second semiconductor substrate is the same as the first substrate.

6. The signal isolator of any of claims 1, 3 or 4 wherein there are formed on or in the first substrate one or more elements other than the first transformer, which elements are not part of the input circuit or output circuit.

7. The signal isolator of claim 1 wherein the transformer comprises a first winding disposed on or in a first surface of the first substrate and a second winding disposed on or in an opposing second surface of the first substrate.

8. The signal isolator of any of claims 1, 2, 4, 5 and 7 further including a Faraday shield disposed between the windings of the transformer.

9. The signal isolator of any of claims 1, 2, 4, 5 and 7 wherein the first substrate is formed of a material having a resistivity substantially higher than 10 ohm-cm.

10. The isolator of any of claims 1-5 further including an insulation material disposed between windings of the transformer.

11. The isolator of claim 10, further comprising a layer of dielectric material is disposed on a surface of the first substrate between the substrate and the bottom winding of the transformer.

12. The isolator of claim 11 wherein said input circuit is operatively connected to drive the first winding and said output circuit is operatively connected to receive a signal from the second winding responsive to the drive from said input circuit.

13. A multi-channel isolator in which two or more channels are provided for communicating in opposing directions, comprising:

a first semiconductor substrate containing input circuitry for channels of first directionality and output circuitry for channels of second, opposing directionality;

a second semiconductor substrate containing output circuitry for channels of first directionality and input circuitry for channels of second directionality; and

a third substrate containing one or more transformers each with first windings in or on the third substrate and with second windings disposed above the first windings and with interconnections from the first substrate circuitry to the first windings and from the second substrate circuitry to the second windings.

14. A signal isolator comprising:

a first substrate;

a coil formed in or on the first substrate for use in generating a magnetic field;

a magnetic field-receiving element formed under or over the coil and spaced therefrom by an insulator;

an input circuit operatively connected to drive the coil in response to a received input signal;

an output circuit operatively connected to generate an output signal responsive to a signal from the field-receiving element; and

wherein neither the input circuit nor the output circuit is formed on the first substrate.

15. The signal isolator of claim 14 wherein the field-receiving element includes at least one MR element.

16. A method of providing signal isolation comprising:

providing a first substrate;

forming a first transformer on the first substrate the transformer including a first, bottom winding and a second, top winding an;

operatively connecting to the first winding of the transformer a first input circuit to drive the transformer in response to a received input signal; and

operatively connecting a first output circuit to the second winding of the transformer to generate an output signal responsive to a signal from the transformer;

operatively connecting to the second winding of the transformer a second input circuit to drive the transformer in response to a received input signal; and

operatively connecting a second output circuit to the first winding of the transformer to generate an output signal responsive to a signal from the transformer,

without forming at least one of the input circuits and the output circuits on the first substrate.

17. The method of claim 16 wherein the act of forming the transformer includes forming the transformer with the first winding disposed on the first substrate and the second winding disposed above the first winding and electrically insulated from the first winding.

18. The method of claim 16 further including:

forming at least one of the input circuit and the output circuit in or on a semiconductor substrate which is not the first substrate.

19. The method of claim 18 wherein the input circuit is formed in or on a first semiconductor substrate and the output circuit is formed in or on a second semiconductor substrate.

20. The method of claim 19 wherein either the first semiconductor substrate or the second semiconductor substrate is the same as the first substrate.

21. The method of any of claims 16, 18 or 19 further including forming on or in the first substrate one or more elements other than the first transformer, which elements are not part of the input circuit or output circuit.

22. The method of claim 16 wherein forming the transformer includes forming the first winding disposed on or in a first surface of the first substrate and the second winding disposed on or in an opposing second surface of the first substrate.

23. The method of any of claims 16, 17, 19, 20 and 22 further including providing a Faraday shield disposed between the windings of the transformer.

24. The method of any of claims 16, 17, 19, 20 and 22 further including forming the first substrate of a material having a resistivity substantially higher than 10 ohm-cm.

25. The method of any of claims 16-20 further including disposing an insulation material between windings of the transformer.

26. The method of claim 25 wherein said method further includes disposing a layer of dielectric material on a surface of the first substrate between the substrate and the bottom winding of the transformer.

27. The method of claim 26 further including operatively connecting said input circuit to drive the first winding and said output circuit to receive a signal from the second winding responsive to the drive from said input circuit.

28. A method for forming a multi-channel isolator in which two or more channels are provided for communicating in opposing directions, comprising:

forming on a first semiconductor substrate input circuitry for channels of first directionality and output circuitry for channels of second, opposing directionality;

forming on a second semiconductor substrate output circuitry for channels of first directionality and input circuitry for channels of second directionality;

forming on a third substrate one or more transformers each with a first winding in or on the third substrate and with a second winding disposed above said transformer'"'"'s first winding; and

interconnecting the first substrate circuitry to the first windings and the second substrate circuitry to the second windings.

29. A method for forming a signal isolator comprising:

providing a first substrate;

forming a coil in or on the first substrate for use in generating a magnetic field;

forming a magnetic field-receiving element under or over the coil and spaced therefrom by an insulator;

operatively connecting an input circuit to drive the coil in response to a received input signal; and

operatively connecting an output circuit to generate an output signal responsive to a signal from the field-receiving element;

wherein neither the input circuit nor the output circuit is formed on the first substrate.

30. The method of claim 29 wherein the field-receiving element includes at least one MR element.

31. A signal isolator comprising:

a first substrate;

a single transformer formed on the first substrate including first, bottom winding and a second, top winding and;

an input circuit operatively connected to drive the second winding of the transformer in response to a received input signal;

an output circuit operatively connected to generate an output signal responsive to a signal from first winding of the transformer;

a second input circuit operatively connected to drive the first winding; and

a second output circuit operatively connected to receive a signal from the second winding responsive to the drive from the second input circuit,

wherein at least one of the input circuits and the output circuits is not formed on the first substrate.

32. The signal isolator of claim 31 wherein the transformer includes a first winding disposed in or on the first substrate and a second winding disposed above the first winding and electrically insulated from the first winding.

33. The signal isolator of claim 31 wherein at least one of the input circuit and the output circuit is formed in or on a semiconductor substrate which is not the first substrate.

34. The signal isolator of claim 33 wherein the input circuit is formed in or on a first semiconductor substrate and the output circuit is formed in or on a second semiconductor substrate.

35. The signal isolator of claim 31 wherein either the first semiconductor substrate or the second semiconductor substrate is the same as the first substrate.

36. The signal isolator of claim 31 wherein the transformer comprises a first winding disposed on or in a first surface of the first substrate and a second winding disposed on or in an opposing second surface of the first substrate.

37. The signal isolator of any of claims 31-36 wherein the first substrate is formed of a material having a resistivity substantially higher than 10 ohm-cm.

38. The isolator of any of claims 31-36 further including an insulation material disposed between windings of the transformer.

39. The signal isolator of claim 38 wherein the first substrate is formed of a material having a resistivity substantially higher than 10 ohm-cm.

40. The isolator of any of claims 31-36 further comprising a layer of dielectric material is disposed on a surface of the first substrate between the substrate and the bottom winding of the transformer.

41. The isolator of claim 40 wherein said input circuit is operatively connected to drive the second winding and said output circuit is operatively connected to receive a signal from the first winding responsive to the drive from said input circuit.

42. The isolator of claim 40 wherein said input circuit is operatively connected to drive the first winding and said output circuit is operatively connected to receive a signal from the second winding responsive to the drive from said input circuit.

43. A signal isolator comprising:

a substrate;

a transformer including a bottom winding provided on the substrate and a top winding provided over the bottom winding;

a first circuit connected to the top winding of the transformer to receive a signal from the top winding responsive to a drive signal applied to the bottom winding; and

a second circuit connected to the bottom winding of the transformer to receive a signal from the bottom winding responsive to a drive signal applied to the top winding,

wherein at least one of the first and second circuits is formed separate from the first substrate.

44. A multi-channel isolator in which two or more channels are provided for communicating in opposing directions, comprising:

a first semiconductor substrate containing input circuitry for a channel of first directionality and output circuitry for channels of second, opposing directionality;

a second semiconductor substrate containing output circuitry for a channel of first directionality and input circuitry for channels of second directionality; and

a transformer including first windings on one of the first and second semiconductor substrates and second windings disposed above the first windings and further including interconnections from the first substrate circuitry to the first windings and from the second substrate circuitry to the second windings.