Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same

• US 7,545,075 B2
• Filed: 06/04/2005
• Issued: 06/09/2009
• Est. Priority Date: 06/04/2004
• Status: Active Grant

• Current Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Original Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Inventors: Cheng, Ching-Hsiang, Ergun, Arif S., Huang, Yongli, Khuri-Yakub, Butrus T., Zhuang, Xuefeng
• Primary Examiner(s): Dougherty; Thomas M
• Application Number:
  US11/144,184
• Publication Number:
  US 20060075818A1
• Time in Patent Office: 1,466 Days
• Field of Search: 367/181, 310/309
• US Class Current: 310/309
• CPC Class Codes: B06B 1/0292 Electrostatic transducers, e.g. electret-type

Abstract

The embodiments of the present invention provide a CMUT array and method of fabricating the same. The CMUT array has CMUT elements individually or respectively addressable from a backside of a substrate on which the CMUT array is fabricated. In one embodiment, a CMUT array is formed on a front side of a very high conductivity silicon substrate. Through wafer trenches are etched into the substrate from the backside of the substrate to electrically isolate individual CMUT elements formed on the front side of the substrate. Electrodes are formed on the backside of the substrate to individually address the CMUT elements through the substrate.

Claims

1. A capacitive micromachined ultrasonic transducer (CMUT) structure, comprising:

a plurality of CMUT elements, each CMUT element comprising;

at least one CMUT device that includes;

a high conductivity substrate having a front side and a backside;

an insulating layer disposed on the front side of the high conductivity substrate and forming CMUT device dielectric walls;

a membrane layer supported by the insulating layer dielectric walls;

a cavity formed between the membrane layer and the substrate; and

an electrode on the backside of the substrate for controlling of the CMUT device through the substrate; and

at least first and second isolation spaces formed in the substrate on at least two sides of the CMUT element and extending from the substrate backside through the substrate to the substrate front side for electrically isolating the plurality of CMUT elements from one another.

2. The CMUT structure of claim 1 attached to a control circuit with the backside of the substrate facing the control circuit.

3. The CMUT structure of claim 1 mounted on a flexible printed circuit board with the backside of the substrate facing the printed circuit board.

4. The CMUT structure of claim 1, further comprising a substrate backside electrode, electrically isolated from substrate backside electrodes of other CMUT elements, for addressing the at least one CMUT device in the respective CMUT element through the substrate.

5. The CMUT structure of claim 1, wherein the first and second isolation spaces comprise at least first and second isolation trenches formed in the substrate and extending from the substrate backside through the substrate to the substrate front side.

6. The CMUT structure of claim 1, wherein the at least one CMUT element comprises a plurality of CMUT elements.

7. The CMUT structure of claim 5, wherein each of the plurality of CMUT elements comprises a plurality of CMUT devices, and each CMUT device is not separated from other CMUT devices by isolation trenches.

8. The CMUT structure of claim 6, wherein the membrane layer is continuous between neighboring CMUT elements and the CMUT structure comprises a plurality of CMUT elements joined by the membrane.

9. The CMUT structure of claim 1, further comprising a second substrate, and the CMUT structure further comprises a plurality of discrete CMUT elements joined by the second substrate.

10. The CMUT structure of claim 9, wherein the second substrate comprises a flexible substrate material.

11. The CMUT structure of claim 1, wherein the membrane is joined to the insulating layer dielectric walls by a fusion bond.

12. The CMUT structure of claim 1, further comprising a metal conductor thin film formed on a top surface of the membrane layer to serve as a common electrode shared by at least some of the CMUT elements in the CMUT structure.

13. The CMUT structure of claim 1, wherein the metal conductor thin film and the membrane layer are formed together and fusion bonded to the insulating layer dielectric walls by a fusion bond.

14. The CMUT structure of claim 5, wherein the isolation trenches extend through the substrate and through the insulating layer to the membrane.

15. The CMUT structure of claim 5, wherein the width of the isolation trenches are adjusted to lower capacitive coupling between CMUT elements to negligible levels.

16. The CMUT structure of claim 1, wherein the CMUT structure provides for addressing individual CMUT elements with a low RO time constant and adapted for interconnection with a control circuit or a readout circuit.

17. The CMUT structure of claim 1, wherein a width of the isolation spaces are adjusted to lower capacitive coupling between CMUT elements to negligible levels.

18. The CMUT structure of claim 1, further comprising a second insulating layer covering at least a portion of the top surface of the substrate at the bottom of the cavity and not forming dielectric walls to prevent shorting of the membrane to the substrate during operation.

19. The CMUT structure of claim 1, wherein the top surface of the substrate is etched toward the substrate backside to extend the cavities into the substrate to form deeper cavities.

20. The CMUT structure of claim 5, wherein the isolation trenches are left unfilled.

21. The CMUT structure of claim 5, wherein the isolation trenches are filled with an insolating material that has a low dielectric constant.

22. The CMUT structure of claim 1, further comprising a metal conductor thin film formed on a top surface of the membrane to serve as a common electrode shared by at least some of the CMUT elements in the CMUT structure.

23. The CMUT structure of claim 1, wherein the CMUT structure includes a plurality of CMUT elements separated by the isolation trenches that are at least one of:

(i) folded proximate the isolation trenches so that in operation pressure waves from the CMUT devices directed in a desired direction, (ii) folded inwardly proximate the isolation trenches so that in operation pressure waves from the CMUT devices are focused on a particular region, and (iii) folded outwardly proximate the isolation trenches so that in operation pressure waves from the CMUT devices are directed outwardly.

24. The CMUT structure of claim 5, wherein the isolation trenches are formed in the shape of at least one of a cut, a rectangular slot, and an angled wedge to permit inward folding of adjacent CMUT elements.

25. The CMUT structure of claim 5, wherein the CMUT structure has a folded configuration wherein the plurality of CMUT elements are mounted on a flexible material and joined together by spring connections between neighboring CMUT elements.

26. The CMUT structure of claim 5, wherein the CMUT structure includes a plurality of CMUT elements arranged as a two-dimensional array on a flexible substrate, and the isolation trenches surround each of the plurality of CMUT elements.

27. The CMUT structure of claim 26, wherein the two-dimensional CMUT structure is folded about the isolation trenches to form a three-dimensional non-planar CMUT structure in which a plurality of CMUT elements each carrying a plurality of CMUT devices face different directions.