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Organometallic compounds

  • US 7,547,631 B2
  • Filed: 10/04/2006
  • Issued: 06/16/2009
  • Est. Priority Date: 07/31/2006
  • Status: Active Grant
First Claim
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1. A method of depositing a film comprising the steps of:

  • providing a substrate in a vapor deposition reactor;

    conveying as a precursor an organometallic compound of the formula (R1YCR2PR3)nM+mL1(m-n)L2p, wherein R1, R2 and R3 are independently chosen from H, (C1-C6)alkyl, (C2-C6)alkenyl, (C2-C6)alkynyl and aryl;

    Y═

    N or P;

    M=a metal;

    L1=an anionic ligand;

    L2=a neutral ligand;

    m=the valence of M;

    n=1-6;

    p=0-3; and

    wherein m>

    n in a gaseous form to the reactor; and

    depositing a film comprising the metal on the substrate.

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