High thermal conductivity dielectric tape

• US 7,547,847 B2
• Filed: 09/19/2006
• Issued: 06/16/2009
• Est. Priority Date: 09/19/2006
• Status: Active Grant

• Current Assignee: Siemens Energy Incorporated (Siemens AG)
• Original Assignee: Siemens Energy Incorporated (Siemens AG)
• Inventors: Miller, Mark L.
• Primary Examiner(s): Nguyen; Chau N
• Application Number:
  US11/523,238
• Publication Number:
  US 20080066942A1
• Time in Patent Office: 1,001 Days
• Field of Search: 174/120.R, 174/120.SR, 174/137.R
• US Class Current: 174/120.00R
• CPC Class Codes: B32B 5/26 another layer next to it also being fibrous or filamentary relative arrangement of fibres or filaments of different layers B32B5/12
• CPC Class Codes: H01B 3/04 mica

Abstract

An electrical insulation tape that has a first and second carrier layer, and a dielectric thermally conductive, electrically insulative filler layer (24) that has mica particles/flakelets (6), filler particles (26) and a binder resin (28), disposed between the first and second carrier layers. The dielectric filler layer has mica flakelets (30), filler particles (32) and a binder resin. The ratio of mica flakelets to filler particles is at least 1:1 by volume, and the percentage of binder resin in the dielectric filler layer is 35-50% by volume. The first and second carrier layers are impregnated with a second resin.

Claims

1. An electrical insulation tape comprising:

a first and second carrier layers; and

a dielectric filler layer disposed between said first and said second carrier layers;

wherein said dielectric filler layer comprises mica flakelets, filler particles and a binder resin;

wherein the ratio of said mica flakelets to said filler particles is at least 1;

1 by volume;

wherein the percentage of said binder resin in said dielectric filler layer is 25-50% by volume;

wherein said first and said second carrier layers are impregnated with a second resin, wherein said second resin is a thermoset polymeric resin;

wherein said filler particles comprise at least one of ZnO, BeO and SiC; and

wherein said filler particles have a length of between 1-100,000 nm and an aspect ratio of approximately 5-50.

2. The electrical insulation tape according to claim 1, wherein said second resin is a b-stage resin.

3. The electrical insulation tape according to claim 1, wherein said carrier layers are glass fabric.

4. The electrical insulation tape according to claim 1, wherein said filler particles are discoids and platelets.

5. The electrical insulation tape according to claim 1, wherein said filler particles have been surface treated to introduce surface functional groups that allow for the essentially complete co-reactivity with said binder resin.

6. The electrical insulation tape according to claim 5, wherein said functional groups comprise at least one of hydroxyl, carboxylic, amine, epoxide, silane and vinyl groups.

7. The electrical insulation tape according to claim 1, wherein said binder resin includes epoxy, polyimide epoxy, liquid crystal epoxy or cyanate-ester.

8. An electrical insulation tape comprising:

a first and a second glass fabric layer; and

a dielectric filler layer disposed between said first and said second glass fabric layers;

wherein said dielectric filler layer comprises mica flakelets, thermally conductive filler particles and a binder resin;

wherein the ratio of said mica flakelets to said filler particles is at least 1;

1 by volume;

wherein the percentage of said binder resin in said filler layer is 25-50% by volume;

wherein said first and said second glass fabric layers are pre-impregnated with a second thermoset polymeric resin;

wherein the thermally conductive filler particles further comprise particles of an inorganic material coated with a material exhibiting a higher thermal conductivity than that of the inorganic material.

9. The electrical insulation tape according to claim 8, wherein said second thermoset polymeric resin is a b-stage resin.

10. The electrical insulation tape of claim 8, wherein the inorganic material comprises silica.

11. The electrical insulation tape of claim 8, wherein the material exhibiting a higher thermal conductivity than that of the inorganic material comprises at least one of ZnO, BeO and SiC.