Underfill and encapsulation of semiconductor assemblies with materials having differing properties
First Claim
1. A semiconductor device assembly comprising:
- at least one semiconductor die having lateral sides, a back side, and an active surface including a plurality of discrete conductive elements projecting therefrom; and
a carrier substrate bearing a plurality of conductive traces in electrical communication with the plurality of discrete conductive elements;
wherein at least a portion of the semiconductor device assembly is covered with a first cured photopolymer material, the first cured photopolymer material comprising a polymerized matrix having a plurality of discrete particles dispersed therethrough.
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Accused Products
Abstract
Polymerized materials for forming the underfill and encapsulation structures for semiconductor package are disclosed. A filler constituent, such as boron nitride, silicates, elemental metals, or alloys, may be added to a liquid photopolymer resin to tailor the physical properties thereof upon curing. The filler constituents may be employed to alter the coefficient of thermal expansion, thermal conductivity, or electrical conductivity of the polymerized material. A number of different embodiments are disclosed that employ the above materials in selected regions of the underfill and encapsulation structures of the semiconductor package. The polymerized materials may also be used to form support structures and covers for optically interactive semiconductor devices. Methods for forming the above structures using stereolithography are also disclosed.
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Citations
25 Claims
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1. A semiconductor device assembly comprising:
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at least one semiconductor die having lateral sides, a back side, and an active surface including a plurality of discrete conductive elements projecting therefrom; and a carrier substrate bearing a plurality of conductive traces in electrical communication with the plurality of discrete conductive elements; wherein at least a portion of the semiconductor device assembly is covered with a first cured photopolymer material, the first cured photopolymer material comprising a polymerized matrix having a plurality of discrete particles dispersed therethrough. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor package comprising:
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at least one semiconductor die having an active surface including an array of optically interactive semiconductor devices defining at least one image sensor on the at least one semiconductor die; and a substantially opaque support structure that surrounds the array of optically interactive semiconductor devices formed from a first cured photopolymer material. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25)
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Specification