Micro-electromechanical ink ejection mechanism utilizing through-wafer ink ejection

• US 7,549,728 B2
• Filed: 08/14/2006
• Issued: 06/23/2009
• Est. Priority Date: 07/15/1997
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Do; An H
• Application Number:
  US11/503,084
• Publication Number:
  US 20060273691A1
• Time in Patent Office: 1,044 Days
• Field of Search: 347/54, 347/65
• US Class Current: 347/54
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1643 thin film formation by plating
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16585 for paper-width or non-reciprocating print heads
• CPC Class Codes: B41J 2/17503 Ink cartridges
• CPC Class Codes: B41J 2/17513 Inner structure
• CPC Class Codes: B41J 2/17596 Ink pumps, ink valves
• CPC Class Codes: B41J 2002/041 Electromagnetic transducer
• CPC Class Codes: B41J 2202/21 : Line printing
• CPC Class Codes: B41J 3/445 : Printers integrated in other types of apparatus, e.g. printers integrated in cameras
• CPC Class Codes: B82Y 30/00 : Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: G06F 21/79 : in semiconductor storage media, e.g. directly-addressable memories
• CPC Class Codes: G06F 21/86 : Secure or tamper-resistant housings
• CPC Class Codes: G06F 2221/2129 : Authenticate client device independently of the user
• CPC Class Codes: G06K 1/121 : by printing code marks applying code marks to labels B65C9/46; marking or coding completed packages B65B61/26
• CPC Class Codes: G06K 19/06037 : multi-dimensional coding
• CPC Class Codes: G06K 19/073 : Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 7/14 : using light without selection of wavelength, e.g. sensing reflected white light G06K7/10831 - G06K7/1097 take precedence
• CPC Class Codes: G06K 7/1417 : 2D bar codes
• CPC Class Codes: G11C 11/56 : using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
• CPC Class Codes: H04N 1/2112 : using still video cameras
• CPC Class Codes: H04N 1/2154 : the still video camera incorporating a hardcopy reproducing device, e.g. a printer
• CPC Class Codes: H04N 2101/00 : Still video cameras
• CPC Class Codes: H04N 23/00 : Cameras or camera modules comprising electronic image sensors; Control thereof
• CPC Class Codes: H04N 5/2628 : Alteration of picture size, shape, position or orientation, e.g. zooming, rotation, rolling, perspective, translation

Abstract

A micro-electromechanical ink ejection mechanism for an inkjet printer includes a substrate that defines an ink ejection channel through which ink can be ejected. A drive circuitry layer is positioned on the substrate. A wall extends from the substrate. An ink ejection member, together with the wall and the substrate, defines an ink chamber into which ink can be supplied. The ink ejection member and the wall are positioned so that the ink chamber is in fluid communication with an inlet of the ink ejection channel. An actuating device is connected to the drive circuitry layer and configured to displace the ink ejection member reciprocally so that the volume of the ink chamber can be decreased and subsequently increased to eject ink through the ink ejection channel.

Claims

1. A micro-electromechanical ink ejection mechanism for an inkjet printer, the ink ejection mechanism comprising:

a substrate that defines an ink ejection channel through which ink can be ejected;

a drive circuitry layer positioned on the substrate;

a wall extending from the substrate;

an ink ejection member which, together with the wall and the substrate, defines an ink chamber into which ink can be supplied, the ink ejection member and the wall being positioned so that the ink chamber is in fluid communication with an inlet of the ink ejection channel; and

an actuating device connected to the drive circuitry layer and configured to displace the ink ejection member reciprocally so that the volume of the ink chamber can be decreased and subsequently increased to eject ink through the ink ejection channel.

2. A micro-electromechanical ink ejection mechanism as claimed in claim 1, wherein the ink ejection member is shaped to define an included volume which forms part of the nozzle chamber.

3. A micro-electromechanical ink ejection mechanism as claimed in claim 1, further including a roof wall mounted to the substrate within the ink chamber and defining an ink ejection port through which ink in the chamber can be ejected into the ink ejection channel.

4. A micro-electromechanical ink ejection mechanism as claimed in claim 3, in which the wall overlaps the ink ejection member.

5. A micro-electromechanical ink ejection mechanism as claimed in claim 1, in which the actuating device includes a deformable body fast, at one end, with respect to the substrate, a heating element being positioned in the body and connected to the drive circuitry layer to heat the deformable body on receipt of an electrical signal from the drive circuitry layer, the body being of a material having a coefficient of thermal expansion which is such that, upon heating, expansion of the material can be harnessed to perform work, and an arm extending from the body and connected to the ink ejection member.

6. A micro-electromechanical ink ejection mechanism as claimed in claim 5, wherein the actuating device includes a support extending from the substrate with one end of the body fast with the support so that the support provides a bending anchor.

7. A micro-electromechanical ink ejection mechanism as claimed in claim 1, in which an enclosure is positioned on the substrate, the actuating device being positioned in the enclosure with the arm extending out of the enclosure.