Techniques and systems for analyte detection
First Claim
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1. A method of fabricating a sensing device comprising:
- providing a semiconductor substrate having a conductor on the substrate;
forming a contact to the conductor;
forming a first insulating layer on an integrated circuit device that comprises the semiconductor substrate having the contact to the conductor formed thereon;
planarizing the integrated circuit device exposing the contact, to thereby form a planarized integrated circuit device; and
depositing a sensing material on the planarized integrated circuit device, wherein the sensing material is in electrical contact with the contact,wherein the depositing further comprises;
depositing conductive particles on the planarized integrated circuit device; and
covering the conductive particles with a nonconductive organic material.
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Abstract
Techniques are used to detect and identify analytes. Techniques are used to fabricate and manufacture sensors to detect analytes. An analyte (810) is sensed by sensors (820) that output electrical signals in response to the analyte. The electrical signals may be preprocessed (830) by filtering and amplification. In one embodiment, a plurality of sensors are formed on a single integrated circuit. The sensors may have diverse compositions.
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Citations
6 Claims
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1. A method of fabricating a sensing device comprising:
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providing a semiconductor substrate having a conductor on the substrate; forming a contact to the conductor; forming a first insulating layer on an integrated circuit device that comprises the semiconductor substrate having the contact to the conductor formed thereon; planarizing the integrated circuit device exposing the contact, to thereby form a planarized integrated circuit device; and depositing a sensing material on the planarized integrated circuit device, wherein the sensing material is in electrical contact with the contact, wherein the depositing further comprises; depositing conductive particles on the planarized integrated circuit device; and covering the conductive particles with a nonconductive organic material. - View Dependent Claims (2, 3, 4)
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5. A method of fabricating a sensing device comprising:
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providing a semiconductor substrate having a conductor on the substrate; forming a contact to the conductor; forming a first insulating layer on an integrated circuit device that comprises the semiconductor substrate having the contact to the conductor formed thereon; planarizing the integrated circuit device exposing the contact, to thereby form a planarized integrated circuit device; and depositing a sensing material on the planarized integrated circuit device, wherein the sensing material is in electrical contact with the contact, wherein the sensing material comprises a sacrificial particle filler. - View Dependent Claims (6)
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Specification