Integrated circuit package and system interface
First Claim
1. An apparatus for enhancing the performance and extending the frequency range of integrated circuit packages, comprising:
- a fissure added to a Flip-Chip (FC) package in order to improve a cross talk performance of said FC package for high and low frequency ranges;
an AC ground connected to said fissure; and
a top wall of said fissure configured utilizing a heat spreader layer in order to form an improved IC package based on said FC package in association with said fissure and said top wall thereof.
8 Assignments
0 Petitions
Accused Products
Abstract
An apparatus for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low frequencies. The wall of the fissure can be implemented with a heat spreader layer and can be connected to any AC ground such as VSS or VDD package planes. The fissures can also accommodate the ingress of an optical fiber, which allows for a direct interface with the transceivers. The direct optical fiber interface permits the removal of solder balls for high speed signal traces, with their respective vias. On-chip integrated LEDs or other similar light source transceivers can drive the high speed signal media. Selective deposition of low dielectric material can also improve the frequency response of high speed signal package traces.
-
Citations
8 Claims
-
1. An apparatus for enhancing the performance and extending the frequency range of integrated circuit packages, comprising:
-
a fissure added to a Flip-Chip (FC) package in order to improve a cross talk performance of said FC package for high and low frequency ranges; an AC ground connected to said fissure; and a top wall of said fissure configured utilizing a heat spreader layer in order to form an improved IC package based on said FC package in association with said fissure and said top wall thereof. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
Specification