Stacked redistribution layer (RDL) die assembly package

• US 7,550,857 B1
• Filed: 11/16/2006
• Issued: 06/23/2009
• Est. Priority Date: 11/16/2006
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Scanlan, Christopher M., Longo, Joseph Marco
• Primary Examiner(s): Parekh; Nitin
• Application Number:
  US11/560,496
• Time in Patent Office: 950 Days
• Field of Search: 257/784, 257/686, 257/E23.011
• US Class Current: 257/777
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16146 the bump connector connecting to a via connection in the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73217 Layer and HDI connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18162 : of a chip with build-up interconnect
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor

Abstract

A stacked redistribution layer (RDL) die assembly package includes a substrate, a first level RDL die assembly mounted to the substrate and a second level RDL die assembly mounted to the first level RDL die assembly. The first level RDL die assembly includes a first die comprising bond pads, a first fan out support extending outwardly from sides of the first die, and first traces electrically connected to the bond pads, the first traces being supported by the first fan out support. Similarly, the second level RDL die assembly includes a second die comprising bond pads, a second fan out support extending outwardly from sides of the second die, and second traces electrically connected to the bond pads of the second die, the second traces being supported by the second fan out support.

Claims

1. A stacked redistribution layer (RDL) die assembly package comprising:

a first level RDL die assembly comprising;

a first die comprising bond pads;

a first fan out support extending outwardly from sides of the first die, the fan out support abutting and entirely enclosing all sides of the first die; and

first traces electrically connected to the bond pads, the first traces being supported by the first fan out support;

a second die mounted to the first level RDL die assembly, the second die comprising bond pads on a first surface of the second die;

a substrate comprising traces on a first surface of the substrate, the first level RDL die assembly being directly mounted to the substrate;

first level bond wires electrically connecting terminals of the first traces to the traces of the substrate; and

second level bond wires electrically connecting the bond pads of the second die to the traces of the substrate.

2. The stacked RDL die assembly package of claim 1 further comprising:

an encapsulant encapsulating the first level RDL assembly and the second die; and

electrically conductive vias electrically connected to the first traces and the bond pads of the second die, the electrically conductive vias extending from the first traces and the bond pads through the encapsulant and to a principal surface of the encapsulant, wherein sides of the encapsulant are substantially coplanar with sides of the first fan out support.

3. A stacked redistribution layer (RDL) die assembly package comprising:

a first level RDL die assembly comprising;

a first die comprising bond pads;

a first fan out support extending outwardly from sides of the first die, the fan out support abutting and entirely enclosing all sides of the first die;

first traces electrically connected to the bond pads, the first traces being supported by the first fan out support;

a substrate comprising traces on a first surface of the substrate, the first level RDL die assembly being directly mounted to the substrate;

first level bond wires electrically connecting terminals of the first traces to the traces of the substrate; and

a second die mounted to the first level RDL die assembly, the second die comprising bond pads on a first surface of the second die.

4. The stacked RDL die assembly package of claim 3 further comprising:

a second level RDL die assembly mounted to the first level RDL die assembly, the second level RDL die assembly comprising;

the second die;

a second fan out support extending outwardly from sides of the second die; and

second traces electrically connected to the bond pads of the second die, the second traces being supported by the second fan out support.

5. The stacked RDL die assembly package of claim 4 wherein the second level RDL die assembly is smaller than the first level RDL die assembly, the second level RDL die assembly being mounted inward of the terminals of the first traces.

6. The stacked RDL die assembly package of claim 5 wherein the first die is the same size as the second die.

7. The stacked RDL die assembly package of claim 6 wherein the second fan out support is smaller than the first fan out support.

8. The stacked RDL die assembly package of claim 4 wherein the second level RDL die assembly is pyramid stacked on the first level RDL die assembly.

9. The stacked RDL die assembly package of claim 4 further comprising a third level RDL die assembly mounted to the second level RDL die assembly, the third level RDL die assembly comprising:

a third die comprising bond pads;

a third fan out support extending outwardly from sides of the third die; and

third traces electrically connected to the bond pads of the third die, the third traces being supported by the third fan out support, wherein the third level RDL die assembly is smaller than the second level RDL die assembly, the third level RDL die assembly being mounted inward of terminals of the second traces.

10. The stacked RDL die assembly package of claim 4 wherein the second level RDL die assembly further comprises:

electrically conductive vias extending through the second fan out support, the electrically conductive vias comprising upper lands and lower lands, the upper lands being electrically connected to the second traces; and

electrically conductive bumps electrically connecting the lower lands to the first traces.

11. The stacked RDL die assembly package of claim 4 further comprising a third level RDL die assembly mounted to the second level RDL die assembly, the third level RDL die assembly comprising:

a third die comprising bond pads;

a third fan out support extending outwardly from sides of the third die; and

third traces electrically connected to the bond pads of the third die, the third traces being supported by the third fan out support, wherein the third level RDL die assembly is the same size as the first level RDL die assembly, the second level RDL die assembly spacing the third level RDL die assembly above the first level bond wires.

12. The stacked RDL die assembly package of claim 4 further comprising second level bond wires electrically connecting terminals of the second traces to the traces of the substrate.

13. The stacked RDL die assembly package of claim 4 wherein the second level RDL die assembly further comprises:

electrically conductive vias extending through the second fan out support, the electrically conductive vias of the second level RDL die assembly comprising upper lands and lower lands;

electrically conductive bumps electrically connecting the lower lands of the second level RDL die assembly to the first traces of the first level RDL die assembly; and

an underfill material enclosing the bumps.

14. The stacked RDL die assembly package of claim 3 further comprising an adhesive mounting a first surface of the first level RDL die assembly to the first surface of the substrate.

15. A stacked redistribution layer (RDL) die assembly package comprising:

a first level RDL die assembly comprising;

a first die comprising bond pads;

a first fan out support extending outwardly from sides of the first die, the fan out support abutting and entirely enclosing all sides of the first die;

first traces electrically connected to the bond pads, the first traces being supported by the first fan out support;

a second die mounted to the first level RDL die assembly, the second die comprising bond pads on a first surface of the second die;

a substrate comprises traces on a first surface of the substrate, the first level RDL die assembly being directly mounted to the substrate; and

first level bond wires electrically connecting terminals of the first traces to the traces of the substrate.