RFID strap capacitively coupled and method of making same

• US 7,551,141 B1
• Filed: 11/07/2005
• Issued: 06/23/2009
• Est. Priority Date: 11/08/2004
• Status: Expired due to Fees

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Hadley, Mark A., Carrender, Curt L., Smith, John Stephen
• Primary Examiner(s): CHEN, SHIH CHAO
• Application Number:
  US11/269,305
• Time in Patent Office: 1,324 Days
• Field of Search: 343/700.MS, 343/741, 343/742, 343/867, 343/873
• US Class Current: 343/700.0MS
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/83136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95122 : by applying vibration
• CPC Class Codes: H01L 2224/95136 : involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/48 : Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 29/0657 : characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01055 : Cesium [Cs]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10155 : being other than a cuboid
• CPC Class Codes: H01L 2924/10158 : at the passive surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15157 : Top view
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/28 : Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00

Abstract

An electronic assembly with integrated circuit capacitively coupled to antenna. The electronic assembly includes a strap assembly and an antenna assembly. The antenna assembly includes a first substrate and antenna elements. The strap assembly includes a second substrate and an integrated circuit embedded within the second substrate and substantially flush with a surface of the second substrate. Interconnections are formed to the integrated circuit. The interconnections are formed on the surface of the second substrate. The antenna assembly and the strap assembly are affixed to one another with the surface of the second substrate facing the antenna elements. The antenna elements capacitively couples to the integrated circuit through the interconnections with no direct contact. A non-conductive layer is disposed between the antenna elements and the interconnections providing the capacitive coupling.

Claims

1. A device comprising:

an antenna assembly comprising a first substrate and antenna elements;

a strap assembly overlaying and affixed to said antenna assembly, the strap assembly comprising a second substrate having an integrated circuit embedded within the second substrate, wherein the integrated circuit comprises one or more contact pads, and wherein said integrated circuit being substantially flush with a surface of the second substrate, and interconnections are connected to the integrated circuit through the one or more contact pads, said interconnections being formed on said surface of said second substrate, and wherein the interconnections are substantially larger than the one or more contact pads; and

a non-conductive layer disposed between antenna elements and said interconnections to allow said antenna elements to capacitively couple to said interconnections,

wherein said antenna assembly and said strap assembly are affixed to one another with said surface of said second substrate facing said antenna elements and said antenna elements capacitively coupled to said integrated circuit without direct physical contact between the antenna elements and the integrated circuit.

2. The device of claim 1, wherein said device is an RFID device.

3. The device of claim 1, wherein said interconnections comprising:

a resonator assembly interconnected to said integrated circuit and capacitively coupled to said antenna elements.

4. The device of claim 3, wherein said resonator assembly is formed directly on said surface of said second substrate.

5. The device of claim 4, wherein said resonator assembly comprises a resonator loop having any one of a loop configuration, a box configuration, a double-loop configuration, and a multi-folded loop configuration.

6. The device of claim 5, wherein said antenna assembly further comprises at least two antenna elements isolated from one another and wherein each one of said antenna element includes a portion that is capacitively coupled to said resonator loop.

7. The device of claim 1, further comprising:

a resonator assembly interconnected to said integrated circuit and capacitively coupled to said antenna elements; and

a third substrate with a resonator loop formed thereon to form said resonator assembly, wherein said strap assembly is affixed to said third substrate with said resonator loop interconnecting to said integrated circuit.

8. The device of claim 7, wherein said resonator assembly comprises a resonator loop having any one of a loop configuration, a box configuration, a double-loop configuration, and a multi-folded loop configuration.

9. The device of claim 7, wherein said antenna assembly further comprising at least two antenna elements not in physical contact to one another and wherein each one of said antenna element includes one end that is capacitively coupled to said resonator loop.

10. A label comprising:

a strap assembly comprising a first substrate having an integrated circuit embedded within said first substrate and substantially flush with a surface of said first substrate, wherein the integrated circuit comprises one or more contact pads, and interconnections are formed to contact the one or more contact pads of the integrated circuit, said interconnections being formed on said surface of said first substrate, and wherein the interconnections are substantially larger than the one or more contact pads; and

a double sided non-conductive adhesive having a release liner, said double sided non-conductive adhesive being placed over said surface;

wherein

a second substrate having formed thereon antenna elements, the second substrate overlaying and affixed to the strap assembly by said double sided non-conductive adhesive after removal of the release linear,

wherein said antenna elements and said interconnections are capacitively coupled without direct physical contact and through said non-conductive adhesive.

11. The label of claim 10, wherein said second substrate is any one of a packaging of an item, a jacket of an item, an item, and a label of an item.

12. The label of claim 10 further comprising:

a resonator assembly interconnected to said integrated circuit and capacitively coupled to said antenna elements.

13. The device of claim 12, wherein said resonator assembly is formed directly on said surface of said first substrate.

14. The device of claim 13, wherein said resonator assembly comprises a resonator loop having any one of a loop configuration, a box configuration, a double-loop configuration, and a multi-folded loop configuration.

15. The device of claim 10 further comprising:

a resonator assembly interconnected to said integrated circuit and capacitively coupled to said antenna elements; and

a third substrate with a resonator loop formed thereon to form said resonator assembly, wherein said strap assembly is affixed to said third substrate with said resonator loop interconnecting to said integrated circuit.

16. The device of claim 15, wherein said resonator assembly comprises a resonator loop having any one of a loop configuration, a box configuration, a double-loop configuration, and a multi-folded loop configuration.

17. The device of claim 10, wherein said antenna assembly further comprising at least two antenna elements not in physical contact to one another and wherein each one of said antenna element includes one end that is capacitively coupled to said resonator loop.

18. A device comprising:

an antenna assembly comprising a first substrate and antenna elements; and

a strap assembly attached to and overlaying at least part of the antenna assembly, the strap assembly comprising

a second substrate having an a receptor region;

a conductive layer formed over at least a portion of said receptor region; and

an integrated circuit embedded within said receptor region and over said conductive layer, wherein the integrated circuit comprises one or more contact pads, and wherein the integrated circuit being substantially with a surface of said second substrate; and

,

interconnections are coupled to the integrated circuit through the one or more contact pads, said interconnections being formed on said surface of said second substrate, and wherein the interconnections have areas substantially larger than areas of the one or more contact pads;

wherein said antenna assembly is capacitively coupled to said integrated circuit without direct physical contact between the antenna elements and the integrated circuit; and

through

a non-conductive layer disposed between said antenna elements and said interconnections.

19. The device of claim 18 further comprising:

a resonator assembly interconnected to said integrated circuit and capacitively coupled to said antenna elements.

20. The device of claim 19, wherein said resonator assembly is formed directly on said surface of said second substrate.

21. The device of claim 20, wherein said resonator assembly comprises a resonator loop having any one of a loop configuration, a box configuration, a double-loop configuration, and a multi-folded loop configuration.

22. The device of claim 21, wherein said antenna assembly further comprising at least two antenna elements not in physical contact to one another and wherein each one of said antenna element includes one end that is capacitively coupled to said resonator loop.

23. An RFID device comprising:

an antenna assembly comprising a first substrate and at least one antenna element; and

a strap assembly overlaying and attached to the at least one antenna assembly, the strap assembly comprising;

a second substrate;

an integrated circuit coupled to the second substrate, wherein the integrated circuit comprises one or more contact pads; and

interconnections are coupled to the integrated circuit through the one or more contact pads, said interconnections being formed on a surface of the second substrate, and wherein the interconnections are substantially larger than the one or more contact pads;

wherein said antenna assembly is capacitively coupled to said integrated circuit without direct physical contact between the antenna elements and the integrated circuit through a non-conductive layer disposed between said at least one antenna element and said interconnection.

24. An RFID device comprising:

an antenna assembly comprising a first substrate and antenna elements; and

a strap assembly overlaying and affixed to said antenna assembly, the strap assembly comprising;

a second substrate;

a functional block having an integrated circuit thereon, the functional block being embedded within the second substrate and substantially flush with a surface of the second substrate, wherein the functional block and/or the integrated circuit comprises one or more contact pads, and wherein; and

interconnections are connected to the integrated circuit through one or more said contact pads, said interconnections being formed on said surface of said second substrate, and wherein the interconnections have areas substantially larger than areas of the one or more contact pads,

wherein said antenna elements capacitively couple to said interconnections without direct physical contact between the antenna elements and the integrated circuit through a non-conductive layer disposed between antenna elements and said interconnections.

25. A device comprising:

an antenna assembly comprising a first substrate and antenna, the first substrate being a product package; and

a strap assembly overlaying and affixed to said antenna assembly, the strap assembly comprising a second substrate having an integrated circuit having one or more contact pads, and interconnections connected to the one or more contact pads of the integrated circuit, said interconnections being formed on a surface of said second substrate, and wherein the interconnections have areas substantially larger than areas of the one or more contact pads,

wherein said antenna is inductively or capacitively coupled to said integrated circuit, without having direct electrically conductive contact between the antenna and the integrated circuit.

26. The device of claim 25 wherein the integrated circuit is embedded within the second substrate.

27. The device of claim 25 wherein the antenna is at least one of a screen printed metal, thick film silver, hot stamped foil, and thin film metal.