Fluid cooled electronic assembly

• US 7,551,439 B2
• Filed: 03/28/2006
• Issued: 06/23/2009
• Est. Priority Date: 03/28/2006
• Status: Active Grant

• Current Assignee: Delphi Technologies Ip Limited (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Oberlin, Gary E., Myers, Bruce A., Peugh, Darrel E.
• Primary Examiner(s): Gandhi; Jayprakash N
• Assistant Examiner(s): SMITH, COURTNEY L
• Application Number:
  US11/396,322
• Publication Number:
  US 20070230127A1
• Time in Patent Office: 1,183 Days
• Field of Search: 361/689, 361/699, 361/700, 361/717, 361/719, 257/724, 257/E23.092, 257/E23.098, 165/80.4, 165/104.33, 165/104.21, 165/168, 165/170, 165/134.1, 174/15.1, 174/252, 62/64, 621/71, 622/592
• US Class Current: 361/699
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]

Abstract

An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.

Claims

1. An electronic assembly having thermal cooling fluid comprising:

a housing generally defining a sealed fluid compartment;

an electronic device disposed within the sealed fluid compartment in the housing, wherein the electronic device comprises a semiconductor material;

an inlet port including a first sealed coupler in fluid communication with the sealed fluid compartment for receiving a cooling fluid;

an outlet port including a second sealed coupler in fluid communication with the sealed fluid compartment for passing the cooling fluid out of the housing a circuit board comprising a substrate having electrical circuitry, wherein the electronic device is mounted to the circuit board and the circuit board comprises first and second openings, wherein the electric device is connected to the circuit board and, wherein the first and second sealed couplers are in fluid communication with the first and second openings of the circuit board; and

fluid flow channels defined by at least one surface of the electronic device such that fluid in the fluid flow channels is in fluid communication with the electronic device within the housing, said fluid flow channels allowing fluid to flow from the inlet port through the fluid flow channels and to the outlet port such that the fluid is forced to pass into the sealed compartment and through the fluid flow channels in fluid communication with the electronic device to cool the electronic device and exit out the outlet port.

2. The electronic assembly as defined in claim 1, wherein the fluid flow channels comprise a plurality of channels formed in the semiconductor material on at least one surface of the electronic device.

3. The electronic assembly as defined in claim 2, wherein the electronic device comprises silicon and the plurality of channels are formed in the silicon via a mechanical sawing process.

4. The electronic assembly as defined in claim 1, wherein the electronic device comprises a semiconductor device.

5. The electronic assembly as defined in claim 1, wherein the cooling fluid comprises liquid.

6. The electronic assembly as defined in claim 1 further comprising an external heat exchanger for cooling the fluid passing out of the outlet port, said external heat exchanger supplying cooled fluid to the inlet port.

7. The electronic assembly as defined in claim 1, wherein the assembly is employed on an automotive vehicle.

8. The electronic assembly as defined in claim 1, wherein the housing comprises side walls and a lid sealed to the side walls.

9. The electronic assembly as defined in claim 1, wherein the electronic device comprises at least one of a flip chip, an IGBT and a FET.

10. An electronic assembly having thermal cooling liquid comprising:

a housing generally defining a sealed compartment;

an electronic device disposed within the sealed compartment in the housing, wherein the electronic device comprises a semiconductor material;

a cooling liquid adapted to pass through the sealed compartment in thermal communication with the electronic device to cool the electronic device;

an inlet port including a first sealed coupler in fluid communication with the sealed compartment for receiving the cooling liquid;

an outlet port including a second sealed coupler in fluid communication with the sealed compartment for passing the cooling liquid out of the housing a circuit board comprising a substrate having electrical circuitry, wherein the electronic device is mounted to the circuit board and the circuit board comprises first and second openings, wherein the electronic device is connected to the circuit board and, wherein the first and second sealed couplers are in; and

fluid flow channels defined by at least one surface of the electronic device such that the liquid is in fluid communication with the electronic device the housing, said fluid flow channels allowing the cooling liquid to flow from the inlet port through the fluid flow channels and to the outlet port such that the liquid is forced to pass into the sealed compartment and through the fluid flow channels in fluid communication with the electronic device to cool the electronic device and out the outlet port.

11. The electronic assembly as defined in claim 10, wherein the fluid flow channels comprise a plurality of channels formed on at least one surface of the electronic device.

12. The electronic assembly as defined in claim 11, wherein the electronic device comprises silicon and the plurality of channels are formed in the silicon via a mechanical sawing process.

13. The electronic assembly as defined in claim 11, wherein the electronic device comprises a semiconductor device comprising silicon, and wherein said channels are formed in said silicon.

14. The electronic assembly as defined in claim 10 further comprising an external heat exchange device for cooling the liquid passing out of the outlet port, said external heat exchanger device supplying cooled liquid to the inlet port.

15. The electronic assembly as defined in claim 10, wherein the assembly is employed on an automotive vehicle.

16. The electronic assembly as defined in claim 10, wherein the housing comprises side walls and a lid sealed to the side walls.

17. The electronic assembly as defined in claim 10, wherein the electronic device comprises at least one of a flip chip, an IGBT and an FET.