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Heat dissipation assembly for computing devices

  • US 7,551,441 B2
  • Filed: 11/29/2007
  • Issued: 06/23/2009
  • Est. Priority Date: 01/10/2005
  • Status: Active Grant
First Claim
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1. In an assembly for use in a device comprising a microprocessor and a motherboard that includes a socket for receiving and making electric contact with said microprocessor and a heat sink in thermal contact with said microprocessor, the improvement comprising a water barrier applied to and proximate said socket for preventing water of condensation from contacting areas covered by said water barrier and inner and outer shells and a moisture absorbent therebetween surrounding said heat sink.

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