Heat dissipation assembly for computing devices

• US 7,551,441 B2
• Filed: 11/29/2007
• Issued: 06/23/2009
• Est. Priority Date: 01/10/2005
• Status: Active Grant

• Current Assignee: H Christian Gunderson
• Original Assignee: H Christian Gunderson
• Inventors: Cohen, Alan Mark
• Primary Examiner(s): Thompson, Gregory D
• Application Number:
  US11/947,182
• Publication Number:
  US 20080106863A1
• Time in Patent Office: 572 Days
• Field of Search: None
• US Class Current: 361/699
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20772 within server blades for removing heat from heat source

Abstract

An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink.

Claims

1. In an assembly for use in a device comprising a microprocessor and a motherboard that includes a socket for receiving and making electric contact with said microprocessor and a heat sink in thermal contact with said microprocessor, the improvement comprising a water barrier applied to and proximate said socket for preventing water of condensation from contacting areas covered by said water barrier and inner and outer shells and a moisture absorbent therebetween surrounding said heat sink.

2. The assembly of claim 1 wherein said water barrier comprises a layer of dielectric grease.

3. The assembly of claim 1 wherein said water barrier comprises a low viscosity liquid sprayed over and in proximity to said socket.

4. The assembly of claim 1 wherein said water barrier comprises a liquid in which said motherboard can be dipped.

5. The assembly of claim 1 wherein said microprocessor comprises a CPU in the form of a die appended to a support, said support being in electrical contact with said socket.

6. The assembly of claim 5 wherein said water barrier is further applied to said support surrounding and abutting said die.

7. The assembly of claim 5 wherein said heat sink is in contact with said die.

8. The assembly of claim 1 wherein said moisture absorbent comprises cotton cloth.

9. The assembly of claim 4 wherein said water barrier comprises a liquid in which said motherboard is dipped and which thereupon dries to a solid.

10. The assembly of claim 1 wherein said water barrier comprises a latex paint.

11. The assembly of claim 1 wherein said water barrier comprises an oil base paint.

12. The assembly of claim 1 wherein said water barrier comprises finger nail polish.

13. An assembly for use in a computing device comprising a microprocessor and a mother board that includes a socket for receiving and making electric contact with said microprocessor, said assembly further comprising a casing surrounding at least a portion of said microprocessor, said casing having an inlet and outlet for circulating a coolant proximate said microprocessor and wherein a water barrier is applied to and proximate said socket for preventing water condensation from contacting areas coveted by said barrier wherein a moisture absorbent is applied to said casing to substantially prevent water of condensation from contacting areas proximate said socket and wherein an outer shell is applied to said moisture absorbent and casing to maintain said moisture absorbent proximate said casing.

14. The assembly of claim 13 wherein said moisture absorbent comprises cotton cloth.