Compression of resin impregnated insulating tapes
First Claim
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1. A method of impregnating a matrix comprising:
- impregnating said matrix with a high thermal conductivity material loaded resin, wherein high thermal conductivity materials of said resin comprise 5-60% by volume of said resin, to produce a resin impregnated matrix;
after said impregnating, but prior to curing said resin impregnated matrix compressing said resin impregnated matrix by approximately 5-30%, wherein said compressing is effective to provide a network of said high thermal conductivity materials having reduced distances between said high thermal conductivity materials loaded in said resin; and
curing said resin impregnated matrix to effectively lock a position of said network of said high thermal conductivity materials in place;
wherein said high thermal conductivity materials comprise at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide and diamonds and dendrimers of approximately 1-1000 nm in size, and wherein said high thermal conductivity materials have aspect ratios of 10-50.
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Abstract
The present invention provides for a method of impregnating a matrix with a high thermal conductivity filled resin 32, which produces a resin impregnated matrix. The high thermal conductivity material 30 comprises 5-60% by volume of the resin 32. This is compressed by approximately 5-30%, and the distances between the high thermal conductivity materials loaded in the resin are reduced, and the resin is then cured.
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Citations
20 Claims
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1. A method of impregnating a matrix comprising:
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impregnating said matrix with a high thermal conductivity material loaded resin, wherein high thermal conductivity materials of said resin comprise 5-60% by volume of said resin, to produce a resin impregnated matrix; after said impregnating, but prior to curing said resin impregnated matrix compressing said resin impregnated matrix by approximately 5-30%, wherein said compressing is effective to provide a network of said high thermal conductivity materials having reduced distances between said high thermal conductivity materials loaded in said resin; and curing said resin impregnated matrix to effectively lock a position of said network of said high thermal conductivity materials in place; wherein said high thermal conductivity materials comprise at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide and diamonds and dendrimers of approximately 1-1000 nm in size, and wherein said high thermal conductivity materials have aspect ratios of 10-50. - View Dependent Claims (2, 3)
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4. A method of impregnating an insulating tape used with an electrically conducting object with a high thermal conductivity material loaded resin comprising:
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impregnating said tape with the high thermal conductivity material loaded resin, wherein phonons passing through said resin have a mean phonon path length; after said impregnating, but prior to curing said resin, compressing said tape impregnated with said resin, wherein said compressing comprises reducing the spacing between high thermal conductivity materials within said resin to an average distance below that of said mean phonon path length; and curing said resin, wherein said curing is effective to lock a position of said high thermal conductivity materials with said reduced spacing in place; wherein said high thermal conductivity materials comprise at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide and diamonds and dendrimers of approximately 1-1000 nm in size; and wherein said high thermal conductivity materials comprise 5-60% by volume of said resin. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of adding high thermal conductivity materials to an insulating medium comprising:
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adding said high thermal conductivity materials that comprise at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide and diamonds and dendrimers of approximately 1-1000 nm in size, to said insulating medium, wherein phonons passing through said insulating medium have a mean phonon oath length; impregnating said insulating medium with a resin; after said impregnating and prior to curing said resin, compressing said insulating medium approximately 5-30%, wherein said compressing said insulating medium reduces the spacing between said high thermal conductivity materials within said insulating medium to an average distance below that of said mean phonon path length; and curing said resin, wherein said curing is effective to lock a position of said high thermal conductivity materials with said reduced spacing in place. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification