Methods for packaging image sensitive electronic devices
First Claim
1. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
- mounting the electronic device on a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between a bond pad on the electronic device and the first end of the at least one conductive trace;
forming a shell entirely of a single transparent material to include an integral lens, the integral lens being formed simultaneous to forming the shell; and
enclosing the first end of the at least one conductive trace, the at least one electrical interconnection and the electronic device within the shell.
1 Assignment
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Accused Products
Abstract
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment.
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Citations
19 Claims
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1. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
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mounting the electronic device on a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end and a second end; providing at least one electrical interconnection between a bond pad on the electronic device and the first end of the at least one conductive trace; forming a shell entirely of a single transparent material to include an integral lens, the integral lens being formed simultaneous to forming the shell; and enclosing the first end of the at least one conductive trace, the at least one electrical interconnection and the electronic device within the shell. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
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mounting the electronic device on a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end and a second end; providing at least one electrical interconnection between a bond pad on the electronic device and the first end of the at least one conductive trace; forming a shell entirely of a single transparent material to include an integral lens, the integral lens being formed simultaneous to forming the shell; and adhesively attaching the shell onto the carrier substrate to enclose the first end of the at least one conductive trace, the at least one electrical interconnection and the electronic device. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification