Chip burning system for burning chips of motherboard

• US 7,554,351 B2
• Filed: 05/29/2006
• Issued: 06/30/2009
• Est. Priority Date: 12/26/2005
• Status: Expired due to Fees

• Current Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Inventors: Li, Tao, Zhang, Su-Shun
• Primary Examiner(s): PATEL, PARESH H
• Application Number:
  US11/308,951
• Publication Number:
  US 20070145993A1
• Time in Patent Office: 1,128 Days
• Field of Search: None
• US Class Current: 324/750.05
• CPC Class Codes: G01R 31/2863 Contacting devices, e.g. sockets, burn-in boards or mounting fixtures in general G01R1/04
• CPC Class Codes: G11C 2029/5602 Interface to device under test
• CPC Class Codes: G11C 29/56 External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor

Abstract

A chip burning system includes a burning device (10) with a plurality of burning files stored therein, a transforming circuit (30) for connecting to chips via serial interfaces, a control unit (20) interconnecting the burning device and the transforming circuit via parallel interfaces, and two chips (40,50) for burning. The transforming circuit includes a parallel-to-serial conversion module (301). The control unit includes a terminal (28) configured to output a chip choosing signal to the transforming circuit for choosing one chip from the two chips. The burning device transmits a parallel type burning file to the transforming circuit via the control unit. The transforming circuit transforms the burning file into serial type with the parallel-to-serial conversion module, and the transformed burning file is burned into the chosen chip.

Claims

1. A chip burning system comprising:

at least two chips to be burned;

a burning device with a plurality of burning files stored therein;

a transforming circuit connected to the chips via serial interfaces, the transforming circuit comprising a parallel-to-serial conversion module; and

a control unit interconnecting the burning device and the transforming circuit via parallel interfaces, the control unit comprising a terminal configured to output a chip choosing signal to the transforming circuit for choosing one of the at least two chips;

wherein the burning device transmits a parallel type burning file to the transforming circuit via the control unit, the transforming circuit transforms the burning file into a serial type by the parallel-to-serial conversion module, and the transformed burning file is burned into the chosen chip.

2. The chip burning system as described in claim 1, wherein the transforming circuit further comprises a serial-to-parallel conversion module configured to transform serial data of the chosen chip into parallel data for the burning device checking the data.

3. The chip burning system as described in claim 2, wherein the control unit outputs a read/write control signal to the transforming circuit to control reading or writing data from or to the chosen chip.

4. The chip burning system as described in claim 3, wherein the read/write control signal is sent directly to a control terminal of a buffer that interconnects the parallel-to-serial conversion module and the at least two chips, and via a phase inverter the read/write control signal is sent to a control terminal of another buffer which interconnects the serial-to-parallel conversion module and the at least two chips.

5. The chip burning system as described in claim 1, wherein the transforming circuit comprises two series of buffers connecting to the at least two chips respectively.

6. The chip burning system as described in claim 5, wherein the chip choosing signal is sent to control terminals of one of the two series of buffers to control conduction of the buffers, and the chip choosing signal is sent to control terminals of the other of the two series of buffers via a phase inverter to control conduction of the buffers.

7. The chip burning system as described in claim 1, wherein the control unit outputs a chip-activated signal to the transforming circuit for activating the chips.

8. The chip burning system as described in claim 1, wherein the transforming circuit comprises an oscillating crystal and a frequency demultiplier to provide a clock signal to the two chips.

9. A chip burning system for burning a chip, comprising:

a burning device with a plurality of burning files stored therein;

a control unit configured to control the burning process, the control unit connected to the burning device; and

a transforming circuit connected to the control unit via a parallel interface, and connected to the chip via a serial interface, the transforming circuit comprising a parallel-to-serial conversion module and a serial-to-parallel conversion module;

wherein the burning device transmits a burning file to the control unit, the control unit transmits the burning file to the transforming circuit via the parallel interface, the transforming circuit transforms the burning file into a serial type file by the parallel-to-serial conversion module, and burns the transformed burning file into the chip, the transforming circuit reads data from the chip and transforms the data into a parallel type file by the serial-to-parallel conversion module, and the transformed data is transmitted to the burning device for checking.

10. The chip burning system as described in claim 9, wherein the control unit outputs a read/write control signal to the transforming circuit to control reading or writing data from or to the chip.

11. The chip burning system as described in claim 10, wherein the read/write control signal is sent directly to a control terminal of a buffer that interconnects the parallel-to-serial conversion module and the chip, and via a phase inverters the read/write control signal is sent to a control terminal of another buffer which interconnects the serial-to-parallel conversion module and the chip.

12. The chip burning system as described in claim 9, wherein the transforming circuit comprises two series of buffers adapted to connect to two chips respectively.

13. The chip burning system as described in claim 12, wherein a chip choosing signal is sent to control terminals of one of the two series of buffers to control conduction of the buffers, and the chip choosing signal is sent to control terminals of the other of the two series of buffers via a phase inverter to control conduction of the buffers.

14. The chip burning system as described in claim 9, wherein the control unit outputs a chip-activated signal to the transforming circuit for activating the chip.

15. The chip burning system as described in claim 9, wherein the transforming circuit comprises an oscillating crystal and a frequency demultiplier to provide a clock signal to the chip.

16. A chip burning system comprising:

at least two chips to be burned;

a burning device storing a plurality of files therein about to be burned to each of said at least two chips; and

a control unit electrically interconnecting between said burning device and said each of said at least two chips, said control unit electrically connecting with said each of said at least two chips via a transforming circuit and outputting a chip choosing signal to said transforming circuit in order to choose a selective one of said at least two chips to be burned with said plurality of files by said transforming circuit;

wherein said control unit electrically connects with said transforming circuit via a parallel interface to transmit said plurality of files from said burning device to said transforming circuit, and said transforming circuit electrically connects with said each of said at least two chips via a serial interface to transmit said plurality of files from said transforming circuit to said each of said at least two chips after said transforming circuit transforms said plurality of files to adapt to said parallel interface and said serial interface respectively.