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Electronic module configured for air flow therethrough and system including same

  • US 7,554,804 B2
  • Filed: 06/28/2007
  • Issued: 06/30/2009
  • Est. Priority Date: 06/30/2006
  • Status: Active Grant
First Claim
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1. An electronic module, comprising:

  • a chassis having a first end and a second end opposite the first end;

    a plurality of capacitors positioned within the chassis, wherein at least one of the capacitors is proximate the first end;

    a plurality of bus bars positioned within the chassis proximate the second end; and

    a heat sink positioned between the capacitors and the bus bars, wherein the capacitors, the heat sink and the bus bars are positioned such that when an airflow enters the chassis at the first end, a portion of the airflow sequentially comes in contact with the capacitors, the heat sink, and the bus bars before exiting at the second end.

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