Implantable substrate sensor with back-to-back electrodes
First Claim
1. An implantable sensor assembly, comprising:
- a first sensor having a first surface and a second surface facing different directions, the first surface having an electric circuit and the second surface having at least one electrode;
a second sensor having a first surface and a second surface facing different directions, the first surface having an electric circuit and the second surface having at least one electrode, the first surface of the second sensor being aligned with and directly opposing the first surface of the first sensor such that the second surfaces of the first and second sensors face out from the sensor assembly.
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Accused Products
Abstract
An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by the protective coating, thereby allowing such electrodes to be exposed to body tissue and fluids when the sensor is implanted in living tissue. The substrate on which the electronic circuitry and electrodes are formed is the same substrate or “chip” on which an integrated circuit (IC) is formed, which integrated circuit contains the desired electronic circuitry. Such approach eliminates the need for an hermetically sealed lid or cover to cover hybrid electronic circuitry, and allows the sensor to be made much thinner than would otherwise be possible. In one embodiment, two such substrate sensor may be placed back-to-back, with the electrodes facing outward. As required, capacitors that form part of the sensor'"'"'s electronic circuits are formed on the substrate by placing metalization layers and a dielectric in vacant areas of the substrate surface.
85 Citations
24 Claims
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1. An implantable sensor assembly, comprising:
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a first sensor having a first surface and a second surface facing different directions, the first surface having an electric circuit and the second surface having at least one electrode; a second sensor having a first surface and a second surface facing different directions, the first surface having an electric circuit and the second surface having at least one electrode, the first surface of the second sensor being aligned with and directly opposing the first surface of the first sensor such that the second surfaces of the first and second sensors face out from the sensor assembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A sensor assembly, comprising:
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a first substrate sensor having a first surface and a second surface facing different directions, the second surface having at least one electrode for converting a sensed parameter to a detectable signal, and the first surface having an electric circuit for processing said detectable signal; a second substrate sensor having a first surface and a second surface facing different directions, the second surface having at least one electrode for converting a sensed parameter to a detectable signal, and the first surface having an electric circuit for processing said detectable signal; and
,at least a portion of the first surface of the second substrate sensor being directly opposed to at least a portion of the first surface of the first substrate sensor such that the second surfaces of the first and second substrate sensors face out from the sensor assembly in substantially opposite directions. - View Dependent Claims (11, 12, 13, 14)
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15. A sensor assembly, comprising:
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a first substrate sensor having an electrode surface and a circuit surface facing in different directions, said circuit surface comprising an electric circuit on a semiconductor substrate; a second substrate sensor having an electrode surface and a circuit surface facing in different directions, said circuit surface comprising an electric circuit on a semiconductor substrate; and
,at least a portion of the circuit surface of the second substrate sensor facing at least a portion of the circuit surface of the first substrate sensor such that the electrode surfaces of the first and second substrate sensors face out from the sensor assembly in substantially opposite directions. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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24. An implantable sensor lead comprising:
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a proximal end connected to a controller; a distal end; and at least one sensor assembly within the sensor lead controlled by the controller, the at least one sensor assembly including; a first substrate sensor having a first surface and a second surface facing different directions, the first surface having an electric circuit and the second surface having at least one electrode; a second substrate sensor having a first surface and a second surface facing different directions, the first surface having an electric circuit and the second surface having at least one electrode; and
,at least a portion of the first surface of the second substrate sensor being opposed to at least a portion of the first surface of the first substrate sensor such that the second surfaces of the first and second substrate sensors face out from the sensor assembly in substantially opposite directions.
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Specification