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Micromechanical device having two sensor patterns

  • US 7,555,956 B2
  • Filed: 07/13/2006
  • Issued: 07/07/2009
  • Est. Priority Date: 07/13/2005
  • Status: Active Grant
First Claim
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1. A micromechanical device comprising:

  • a semiconductor material, the semiconductor material including a first sensor pattern, the first sensor pattern being for detecting a first mechanical variable, a functionality of the first sensor pattern being based on a predefined converter principle, the semiconductor material further including a second sensor pattern, the second sensor pattern being for detecting a second mechanical variable, a functionality of the second sensor pattern being based on the predefined converter principle;

    wherein the first sensor pattern has a first diaphragm introduced into the semiconductor material, and the second sensor pattern has a second diaphragm introduced into the semiconductor material, each diaphragm one of (a) including and (b) being connected to at least one sensor region;

    wherein the first sensor pattern has a hermetically sealed first cavity underneath the first diaphragm, and wherein the second diaphragm is provided with support, with the aid of at least one sealed lateral constriction.

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